Patent Assignment
Reel/Frame 049281/0489
Assignment of Assignor's Interest
Recorded: 2019-05-24
Pages: 2
Assignor
TSAI, HUNG-CHI
Executed: 2019-05-08
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Semiconductor Device with Conductive Cap Layer Over Conductive Plug and Method for Forming the Same