Patent Assignment
Reel/Frame 049287/0090
Assignment of Assignor's Interest
Recorded: 2019-05-27
Pages: 4
Assignors
ZHANG, RONGWEI
Executed: 2019-05-17
HUCKABEE, JAMES
Executed: 2019-05-17
GUPTA, VIKAS
Executed: 2019-05-17
Assignee
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD, MS3999, DALLAS, TEXAS, 75243
Covered Property
(1)
Wafer Level Derived Flip Chip Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.