Patent Assignment
Reel/Frame 049291/0792
Assignment of Assignor's Interest
Recorded: 2019-05-28
Pages: 3
Assignors
WANG, YUN-TING
Executed: 2019-05-21
LIN, YI-AN
Executed: 2019-05-21
CHANG, CHING-CHUAN
Executed: 2019-05-21
KUO, PO-CHANG
Executed: 2019-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Warpage Control of Semiconductor Die