Patent Assignment
Reel/Frame 049296/0302
Assignment of Assignor's Interest
Recorded: 2019-05-28
Pages: 4
Assignor
ISHIKAWA, MASAKAZU
Executed: 2019-03-12
Assignee
LINTEC CORPORATION
23-23, HONCHO, ITABASHI-KU, TOKYO, 173-0001, JAPAN
Covered Property
(1)
Dielectric-Heating Bonding Film and Bonding Method Using Dielectric-Heating Bonding Film