Patent Assignment
Reel/Frame 049298/0001
Assignment of Assignor's Interest
Recorded: 2019-05-28
Pages: 4
Assignors
SAHA, AMITESH
Executed: 2019-05-20
CHAN ARGUEDAS, SERGIO ANTONIO
Executed: 2019-05-20
CARTAS, MARCO AURELIO
Executed: 2019-05-21
HACKENBERG, KEN
Executed: 2019-05-21
LI, PENG
Executed: 2019-05-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Integrated Circuit Packages with Solder Thermal Interface Materials with Embedded Particles
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.