Patent Assignment
Reel/Frame 072549/0289
Assignment of Assignor's Interest
Recorded: 2025-09-11
Pages: 71
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties
(64)
Thin-Film Transistor Structures with Gas Spacer
Application:
17/848,224 →
Publication:
US 2022/0320275
Data Stored or Free Space Based Fifo Buffer
Interposer with Step Feature
Encapsulated Die Stack Having Coplanar Heat Spreader and Bond Pad with Different Thicknesses
Application:
16/160,197 →
Publication:
US 2020/0118991
Flexible Configuration of Storage Device with Translation Language Set
Application:
17/165,698 →
Publication:
US 2021/0157512
Integrated Circuit Packages with Solder Thermal Interface Materials with Embedded Particles
Integrated Circuit Structure with Filled Recesses
Lithographically Defined Vertical Interconnect Access (via) for a Bridge Die First Level Interconnect (Fli)
Thin Film Transistors Having Alloying Source or Drain Metals
Application:
16/400,758 →
Publication:
US 2020/0350412
Computational Data Storage Systems
Keep Out Zone with Hydrophobic Surface for Integrated Circuit (Ic) Package
Binary Metallic Alloy Source and Drain (BMAS) for Applying Compressive Stress in Non-Planar Transistor Architectures
Application:
17/353,225 →
Publication:
US 2022/0406938
Device, System and Method for Memory Repair with Multi-Cell Switching
Application:
16/912,498 →
Publication:
US 2021/0407618
Underfill Material for Integrated Circuit (Ic) Package
Application:
16/781,894 →
Publication:
US 2021/0242102
Multi-Height Interconnect Trenches for Resistance and Capacitance Optimization
Place-And-Route Resistance and Capacitance Optimization Using Multi-Height Interconnect Trenches and Air Gap Dielectrics
Application:
16/534,104 →
Publication:
US 2021/0043567
Coherent Multiprocessing Enabled Compute in Storage and Memory
Application:
18/781,854 →
Publication:
US 2024/0378150
Workload Scheduler for Memory Allocation
Systems and Methods for Reducing Latency for Storage Transactions in Virtualized Storage
Application:
18/618,912 →
Publication:
US 2024/0264871
Differential Magnetoelectric Spin Orbit Logic
Application:
17/070,808 →
Publication:
US 2022/0115438
Elemental Composition Tuning for Chalcogenide Based Memory Arranged in a Plurality of Decks
Network Device Intermediary for Memory Access Requests
Application:
17/112,235 →
Publication:
US 2021/0089236
Triangular Board Assembly for Solid State Drive
Application:
17/133,836 →
Publication:
US 2021/0120672
Selective Congestion Notification by a Network Interface Device
Application:
19/009,486 →
Publication:
US 2025/0279962
Loading Frame for High I/O Count Packaged Semiconductor Chip
Multiple Tier Storage Deployment Management Engine
Device-Initiated Input/Output Assistance for Computational Non-Volatile Memory on Disk-Cached and Tiered Systems
Application:
17/313,668 →
Publication:
US 2021/0279007
Ball Grid Array Card Edge Connector
Skew Detection and Compensation for High Speed I/O Links
Managing Quality of Service by Allocating Die Parallelism with Variable Queue Depth
Application:
17/355,915 →
Publication:
US 2021/0392083
Sparse Column-Aware Encodings for Numeric Data Types
Host Managed Hotness Data Utilized for Cache Evictions and/or Insertions
Lifetime Telemetry on Memory Error Statistics to Improve Memory Failure Analysis and Prevention
Application:
17/317,745 →
Publication:
US 2021/0279122
Soft Read Operations with Progressive Data Output
Read Disturb Tracking Based on Statistical Probability
Method and Apparatus to Reduce Latency for Random Read Workloads in a Solid State Drive
Application:
17/536,956 →
Publication:
US 2022/0083280
Automatic Selection of Computational Non-Volatile Memory Targets
Application:
17/459,414 →
Publication:
US 2021/0389890
Ssd with Multiple Bandwidth Tiers Based on Physical Characteristics
Circuits And Methods For Correcting Errors In Memory
Wrap-Around Label for Ssd
Application:
17/559,493 →
Publication:
US 2022/0115231
Cooling Mass and Spring Element for Low Insertion Force Hot Swappable Electronic Component Interface
Application:
18/897,793 →
Publication:
US 2025/0024647
Data Rollback for Tiered Memory and Storage
Releasable Spacer, Solid-State Drive Assembly, and Method to Manufacture the Same
Application:
18/573,521 →
Publication:
US 2024/0373556
Adaptive Device Data Correction with Increased Memory Failure Handling
Shared Data Buffer for Prefetch and Non-Prefetch Entries
Application:
17/688,611 →
Publication:
US 2022/0188000
Cache Evictions Management in a Two Level Memory Controller Mode
Application:
17/559,870 →
Publication:
US 2022/0188228
Self-Gating Flops for Dynamic Power Reduction
Root Complex Integrated Endpoint Emulation of a Discreet Pcie Endpoint
Application:
15/718,110 →
Publication:
US 2019/0095554
Reducing Band-to-Band Tunneling in Semiconductor Devices
Transistor with Wide Bandgap Channel and Narrow Bandgap Source/Drain
Application:
16/612,303 →
Publication:
US 2020/0144374
Techniques for Data Storage Protection and Integrity Checking
Application:
16/420,624 →
Publication:
US 2019/0278525
Method and Apparatus to Enable Individual Non Volatile Memory Express (Nvme) Input/Output (Io) Queues on Differing Network Addresses of an Nvme Controller
Reducing Write Amplification and Over-Provisioning Using Flash Translation Layer Synchronization
Fast Lba/Pba Table Rebuild by Skipping Read of Metadata of Lba Bin That Is Not Mapped
Data Rollback for Tiered Memory and Storage
Application:
19/091,566 →
Publication:
US 2025/0284408
Integrated Circuit Structure with Filled Recesses
Application:
19/300,576 →
Computational Data Storage Systems
Application:
19/184,701 →
Triangular Board Assembly for Solid State Drive
Application:
19/312,500 →
Skew Detection and Compensation for High Speed I/O Links
Application:
19/262,642 →
Sparse Column-Aware Encodings for Numeric Data Types
Application:
19/322,127 →
Soft Read Operations with Progressive Data Output
Application:
19/239,659 →
Ssd with Multiple Bandwidth Tiers Based on Physical Characteristics
Application:
19/322,217 →
Adaptive Device Data Correction with Increased Memory Failure Handling
Application:
19/300,956 →
Reducing Write Amplification and Over-Provisioning Using Flash Translation Layer Synchronization
Application:
19/265,492 →
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 7, 2019
From: ZHANG, JAMES; XU, YI
To: INTEL CORPORATION
Reel/Frame 048271/0726 →
Assignment of Assignor's Interest
May 28, 2019
From: SAHA, AMITESH; CHAN ARGUEDAS, SERGIO ANTONIO; CARTAS, MARCO AURELIO; HACKENBERG, KEN
To: INTEL CORPORATION
Reel/Frame 049298/0001 →
Assignment of Assignor's Interest
Aug 9, 2019
From: ANDERS, MARK; KAUL, HIMANSHU; KRISHNAMURTHY, RAM; LIN, KEVIN LAI
To: INTEL CORPORATION
Reel/Frame 050016/0594 →
Assignment of Assignor's Interest
Aug 9, 2019
From: LIN, KEVIN LAI; KOBRINSKY, MAURO; ANDERS, MARK; KAUL, HIMANSHU
To: INTEL CORPORATION
Reel/Frame 050016/0267 →
Assignment of Assignor's Interest
Aug 29, 2019
From: LIN, KEVIN L.; KABIR, NAFEES A.; BLACKWELL, JAMES MUNRO; HOURANI, RAMI
To: INTEL CORPORATION
Reel/Frame 050210/0087 →
Assignment of Assignor's Interest
Nov 22, 2019
From: DARMAWIKARTA, KRISTOF; IBRAHIM, TAREK; ALUR, SIDDHARTH; JAIN, RAHUL
To: INTEL CORPORATION
Reel/Frame 051097/0079 →
Assignment of Assignor's Interest
Nov 22, 2019
From: KU, CHIEH-JEN; SELL, BERNHARD; WANG, PEI-HUA; GEORGE, GREGORY
To: INTEL CORPORATION
Reel/Frame 051092/0924 →
Assignment of Assignor's Interest
Apr 8, 2020
From: ZIADEH, BASSAM; VAN NAUSDLE, JOSEPH; YANG, ZHOU; LAMBERT, WILLIAM J.
To: INTEL CORPORATION
Reel/Frame 052349/0449 →
Assignment of Assignor's Interest
Apr 23, 2020
From: PON, FLORENCE; XU, YI
To: INTEL CORPORATION
Reel/Frame 052481/0704 →
Assignment of Assignor's Interest
May 7, 2020
From: NOFEN, ELIZABETH; LIN, ZIYIN; ANANTHAKRISHNAN, NISHA
To: INTEL CORPORATION
Reel/Frame 052602/0969 →
Assignment of Assignor's Interest
Jul 8, 2020
From: RADHAKRISHNAN, ARAVINDA; CHEUNG, MARCUS WING-KIN; SOMASEKHAR, DINESH; BHANDARU, NAGA MALLIKA
To: INTEL CORPORATION
Reel/Frame 053146/0478 →
Assignment of Assignor's Interest
Aug 11, 2020
From: WANG, YIPENG; WANG, REN; TAI, TSUNG-YUAN C.; YUAN, YIFAN
To: INTEL CORPORATION
Reel/Frame 053452/0668 →
Assignment of Assignor's Interest
Oct 14, 2020
From: LI, HAI; NIKONOV, DMITRI; LIN, CHIA-CHING; GOSAVI, TANAY
To: INTEL CORPORATION
Reel/Frame 054057/0239 →
Assignment of Assignor's Interest
Feb 2, 2021
From: TARANGO, JOSEPH; BACA, JIM; JACQUE, KRISTIN; HERNANDEZ, ANDRES
To: INTEL CORPORATION
Reel/Frame 055118/0874 →
Assignment of Assignor's Interest
Jul 24, 2021
From: NUGENT, JOHN M.; VIRWANI, KUMAR R.; GEALY, FRED DANIEL
To: INTEL CORPORATION
Reel/Frame 056971/0524 →
Assignment of Assignor's Interest
Aug 9, 2021
From: PAYDAVOSI, NAVID
To: INTEL CORPORATION
Reel/Frame 057126/0119 →
Assignment of Assignor's Interest
Mar 4, 2022
From: MESNIER, MICHAEL P.; KEYS, JOHN S.; ADAMS, IAN F.; ZOU, YI
To: INTEL CORPORATION
Reel/Frame 059172/0396 →
Assignment of Assignor's Interest
Jan 3, 2025
From: PAN, YANJIE; JIANG, YONG; LI, YUANYUAN; ZHANG, YONG
To: INTEL CORPORATION
Reel/Frame 069730/0744 →
Assignment of Assignor's Interest
Jan 13, 2026
From: LAJOIE, TRAVIS W.; GHANI, TAHIR; KAVALIEROS, JACK T.; OGADHOH, SHEM
To: INTEL CORPORATION
Reel/Frame 074331/0209 →