IP Library Assignment 052602/0969
Patent Assignment
Reel/Frame 052602/0969

Assignment of Assignor's Interest

Recorded: 2020-05-07 Pages: 3
Assignors
NOFEN, ELIZABETH
Executed: 2020-01-27
LIN, ZIYIN
Executed: 2020-01-27
ANANTHAKRISHNAN, NISHA
Executed: 2020-01-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Underfill Material for Integrated Circuit (Ic) Package
Application: 16/781,894 →
Publication: US 2021/0242102
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 11, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072549/0289 →