COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPABLE ELECTRONIC COMPONENT INTERFACE
An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.
1 . An apparatus, comprising:
a cooling mass to be thermally coupled to a cooling block, the cooling mass to be positioned adjacent to hot-swappable interface that includes a connector; and
a spring to urge the cooling mass toward an electronic component when the electronic component is plugged into the connector.
2 . The apparatus of claim 1 , wherein insertion of the electronic component into the connector causes a component of the spring to rotate about an axis of rotation into a first position, a force of the spring in the first position to press the cooling mass and the electronic component together, the spring to be in a relaxed state when in a second position, the cooling mass and the electronic component to be separate when the spring is in the second position.
3 . The apparatus of claim 1 , wherein the spring is a torsion spring, and the torsion spring includes a torsion tab, the torsion tab to extend into a path of insertion of the electronic component into the connector.
4 . The apparatus of claim 3 , wherein the spring is to rotate about an axis of rotation in response to the electronic component pushing against the torsion tab as the electronic component is moved along the path of the insertion.
5 . The apparatus of claim 4 , wherein the torsion spring includes a torsion bar that is to urge the cooling mass into the electronic component in response to rotation of the spring caused by the insertion of the electronic component into the connector.
6 . The apparatus of claim 5 , further including a load distribution plate located on a side of the cooling mass opposite to the electronic component, the load distribution plate to spread a force exerted by the torsion bar to urge the cooling mass into the electronic component along a surface of the cooling mass.
7 . The apparatus of claim 1 , wherein the spring is a cantilever spring, the cantilever spring to be in a first position when the electronic component is removed from the connector and spaced apart from the cantilever spring, the spring to be urged into a second position by the electronic component when the electronic component is inserted into the connector.
8 . The apparatus of claim 7 , wherein the first position of the spring corresponds to a relaxed state of the spring, the second position corresponds to a loaded state of the spring, the spring to produce a reactive force when in the loaded state that causes the cooling mass to press into the electronic component.
9 . An apparatus comprising:
a cooling block having a surface;
a cooling mass to protrude away from the surface of the cooling block, the cooling mass having a first end thermally coupled to the cooling block and a free end distal to the cooling block, a side of the cooling mass to be pressed against an electronic component selectively pluggable into a connector coupled to the cooling block adjacent to the first end of the cooling mass.
10 . The apparatus of claim 9 , further including a spring to urge the side of the cooling mass towards the electronic component.
11 . The apparatus of claim 10 , wherein the side of the cooling mass is a first side, the spring adjacent to a second side of the cooling mass opposite the first side.
12 . The apparatus of claim 9 , further including a backplane to be mounted to a circuit board, the backplane including the connector, the backplane to be between the cooling block and the electronic component.
13 . The apparatus of claim 12 , wherein the cooling mass is to extend through an opening in the backplane.
14 . The apparatus of claim 9 , wherein the cooling block further includes a notch, and the first end of the cooling mass extends into the notch.
15 . The apparatus of claim 14 , further including a spring adjacent the cooling mass, the spring to extend into the notch, the spring to press the side of the cooling mass against the electronic component.
16 . An apparatus comprising:
a cooling block;
a cooling mass thermally coupled to the cooling block; and
a connector adjacent to the cooling mass, the connector to receive a component, the connector to hold the component so that the component extends in a direction away from the cooling block, the cooling mass to extend away from the cooling block alongside the component, the cooling mass to be thermally coupled to the component.
17 . The apparatus of claim 16 , further including a thermal interface material on a side of the cooling mass adjacent to the component, the cooling mass thermally coupled to the component via the thermal interface material.
18 . The apparatus of claim 16 , wherein the cooling mass is pressed against the component in response to a force exerted by the component on a spring adjacent to a side of the cooling mass and in contact with the cooling mass.
19 . The apparatus of claim 18 , further including a pivot pin to support the spring, the pivot pin to extend axially in relation to the cooling mass, the pivot pin including a first end and a second end, the first end and the second end extend beyond opposing edges of the cooling mass.
20 . The apparatus of claim 18 , wherein the spring is a cantilever spring, the cantilever spring to include a first end and a second end, the first end extending along the cooling mass and through a notch of an interface between the cooling block and the component, and the second end extending past an end of the cooling mass opposite the cooling block.