Assignment of Assignor's Interest

Recorded: 2026-01-13 Pages: 10

Assignors

SINGH, HARDEEP

Executed: 2022-05-03

SHARMA, RACHIT

Executed: 2022-05-09

HANNA, TIMOTHY GLEN

Executed: 2022-04-13

KULKARNI, DEVDATTA P.

Executed: 2022-05-02

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Cooling Mass and Spring Element for Low Insertion Force Hot Swappable Electronic Component Interface

Application: 18/897,793 →

Publication: US 2025/0024647

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.