Patent Assignment
Reel/Frame 048271/0726
Assignment of Assignor's Interest
Recorded: 2019-02-07
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Encapsulated Die Stack Having Coplanar Heat Spreader and Bond Pad with Different Thicknesses
Application:
16/160,197 →
Publication:
US 2020/0118991
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.