PRE-PATTERNED FINE-PITCH BOND PAD INTERPOSER
Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises, a package substrate, a die stack on the package substrate, and a mold layer encapsulating the die stack. In an embodiment, the electronic package further comprises a bond pad having a first surface and a second surface, where the die stack is electrically coupled to the first surface of the bond pad with a wire bond, and the second surface of the bond pad is substantially coplanar with a surface of the mold layer.
1 . An electronic package, comprising:
a package substrate;
a die stack on the package substrate;
a mold layer encapsulating the die stack; and
a bond pad having a first surface and a second surface, wherein the die stack is electrically coupled to the first surface of the bond pad with a wire bond, and wherein the second surface of the bond pad is substantially coplanar with a surface of the mold layer.
2 . The electronic package of claim 1 , further comprising a heat spreader over a surface of the die stack.
3 . The electronic package of claim 2 , wherein a surface of the heat spreader is substantially coplanar with a surface of the mold layer.
4 . The electronic package of claim 2 , wherein a thickness of the heat spreader is substantially coplanar with a thickness of the bond pad.
5 . The electronic package of claim 2 , wherein the heat spreader and the bond pad comprise the same material.
6 . The electronic package of claim 1 , wherein the die stack is separated from the package substrate by the mold layer.
7 . The electronic package of claim 1 , further comprising:
a wire bond electrically coupling the second surface of the bond pad to the package substrate.
8 . The electronic package of claim 1 , further comprising:
a second die stack positioned above the first die stack.
9 . The electronic package of claim 8 , wherein the second die stack is encapsulated in a second mold layer.
10 . The electronic package of claim 9 , further comprising a second bond pad having a first surface and a second surface, wherein the second die stack is electrically coupled to the first surface of the second bond pad with a wire bond, and wherein the second surface of the bond pad is substantially coplanar with a surface of the second mold layer.
11 . The electronic package of claim 1 , wherein the die stack comprises a plurality of memory dies.
12 . The electronic package of claim 11 , wherein the die stack comprises four or more memory dies.
13 . A die module, comprising:
a plurality of dies in a stack;
a mold layer encapsulating the plurality of dies;
a heat spreader over a surface of one of the plurality of dies, wherein a surface of the heat spreader is substantially coplanar with a first surface of the mold layer; and
a bond pad with a first surface and a second surface, wherein a first surface of the bond pad is substantially coplanar with the first surface of the mold layer, and wherein a wire bond electrically couples the second surface of the bond pad to one of the plurality of dies.
14 . The die module of claim 13 , wherein the plurality of dies are stacked in an offset orientation.
15 . The die module of claim 14 , wherein the plurality of dies are electrically coupled to each other with one or more wire bonds.
16 . The die module of claim 13 , wherein a thickness of the bond pad is substantially equal to a thickness of the heat spreader.
17 . The die module of claim 13 , wherein the bond pad and the heat spreader comprise the same material.
18 . The die module of claim 13 , wherein the plurality of dies are memory dies.
19 . The die module of claim 18 , wherein the plurality of dies comprises four or more memory dies.
20 . The die module of claim 13 , wherein the bond pad is laterally adjacent to the heat spreader.
21 . The die module of claim 20 , wherein a portion of the mold layer separates a sidewall of the heat spreader from a sidewall of the bond pad.
22 . A method of forming a die module, comprising:
providing an interposer, wherein the interposer comprises a heat spreader, a bond pad, and an interposer substrate, wherein the heat spreader and the bond pad are positioned over the interposer substrate;
attaching a die stack to the heat spreader;
wire bonding the die stack to the bond pad;
encapsulating the die stack, the heat spreader, and the bond pad with a mold layer; and
removing the interposer substrate, wherein removal of the interposer substrate electrically isolates the heat spreader from the bond pad.
23 . The method of claim 22 , wherein the bond pad is part of a single integrity power delivery (STPD) test module.
24 . The method of claim 22 , further comprising:
dicing the mold layer to separate a plurality of die stacks into individual modules.
25 . The method of claim 22 , wherein a thickness of the bond pad and a thickness of the heat spreader are substantially equal.