Assignment of Assignor's Interest

Recorded: 2019-08-09 Pages: 6

Assignors

ANDERS, MARK

Executed: 2019-08-05

KAUL, HIMANSHU

Executed: 2019-08-05

KRISHNAMURTHY, RAM

Executed: 2019-08-05

LIN, KEVIN LAI

Executed: 2019-08-06

KOBRINSKY, MAURO

Executed: 2019-08-05

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Place-And-Route Resistance and Capacitance Optimization Using Multi-Height Interconnect Trenches and Air Gap Dielectrics

Application: 16/534,104 →

Publication: US 2021/0043567

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.