TRIANGULAR BOARD ASSEMBLY FOR SOLID STATE DRIVE
An embodiment of an electronic apparatus comprises a main board, a wing board electrically coupled to the main board by a flexible connector along an edge of the main board, wherein the wing board is arranged at an angle that is non-parallel with respect to the main board. Other embodiments are disclosed and claimed.
1 .- 20 . (canceled)
21 . An apparatus comprising:
a first board arranged within an enclosure, wherein the first board comprises a first surface, wherein the first surface comprises a first portion, a second portion, and a third portion between the first portion and the second portion, and wherein the first portion, the second portion, and the third portion are substantially equal in size;
a second board arranged within the enclosure and electrically coupled to the first board, wherein the second board is arranged over the third portion, and wherein the second board is arranged at a first angle that is non-parallel with respect to the first board;
a third board arranged within the enclosure and electrically coupled to the first board, wherein the third board is arranged over the third portion, and wherein the third is arranged at a second angle that is non-parallel with respect to the first board; and
a structure arranged within the enclosure over the third portion, wherein:
the structure is not in contact with the first portion and the second portion,
the structure is not in alignment with the first portion and the second portion when viewed in a direction perpendicular to the first surface of the first board, and
the structure is in mechanical and thermal communication with respective first sides of each of the first board, the second board, and the third board.
22 . The apparatus of claim 21 , wherein the structure comprises a heatsink.
23 . The apparatus of claim 22 , wherein the heatsink comprises an interior air flow channel.
24 . The apparatus of claim 21 , wherein the structure is substantially triangular in shape.
25 . The apparatus of claim 21 , wherein the structure is a first structure, the apparatus further comprises a second structure arranged within the enclosure around the first board, the second board, and the third board, wherein the second structure is in mechanical and thermal communication with a respective second side of each of the first board, the second board, and the third board.
26 . The apparatus of claim 25 , wherein the second structure comprises a heatsink.
27 . The apparatus of claim 25 , wherein the second structure comprises:
a first wall positioned in mechanical and thermal communication with the second side of the second board at the first angle relative to the first board; and
a second wall positioned in mechanical and thermal communication with the second side of the third board at the second angle relative to the first board.
28 . The apparatus of claim 27 , wherein the second structure comprises:
a first set of fins arranged on an exterior side of the first wall; and
a second set of fins arranged on an exterior side of the second wall.
29 . The apparatus of claim 21 , wherein a form factor of the enclosure comprises dimensions that conform to a one rack unit short solid-state drive form factor.
30 . The apparatus of claim 21 , wherein the respective first side of at least one of the first board, the second board, and the third board comprises heat generating electrical components.
31 . A method for manufacturing an apparatus, the method comprising:
arranging a first board within an enclosure, wherein the first board comprises a first surface, wherein the first surface comprises a first portion, a second portion, and a third portion between the first portion and the second portion, and wherein the first portion, the second portion, and the third portion are substantially equal in size;
arranging a second board within the enclosure and electrically coupling the second board to the first board, wherein the second board is arranged over the third portion, and wherein the second board is arranged at a first angle that is non-parallel with respect to the first board;
arranging a third board within the enclosure and electrically coupling the third board to the first board, wherein the third board is arranged over the third portion, and wherein the third is arranged at a second angle that is non-parallel with respect to the first board; and
arranging a structure within the enclosure over the third portion, wherein:
the structure is not in contact with the first portion and the second portion,
the structure is not in alignment with the first portion and the second portion when viewed in a direction perpendicular to the first surface of the first board, and
the structure is in mechanical and thermal communication with respective first sides of each of the first board, the second board, and the third board.
32 . The method of claim 31 , wherein the structure comprises a heatsink.
33 . The method of claim 32 , wherein the heatsink comprises an interior air flow channel.
34 . The method of claim 31 , wherein the structure is substantially triangular in shape.
35 . The method of claim 31 , wherein the structure is a first structure, and the method further comprises arranging a second structure within the enclosure around the first board, the second board, and the third board, wherein the second structure is in mechanical and thermal communication with a respective second side of each of the first board, the second board, and the third board.
36 . The method of claim 35 , wherein the second structure comprises a heatsink.
37 . The method of claim 35 , wherein the second structure comprises:
a first wall positioned in mechanical and thermal communication with the second side of the second board at the first angle relative to the first board; and
a second wall positioned in mechanical and thermal communication with the second side of the third board at the second angle relative to the first board.
38 . The method of claim 37 , wherein the second structure comprises:
a first set of fins arranged on an exterior side of the first wall; and
a second set of fins arranged on an exterior side of the second wall.
39 . The method of claim 31 , wherein a form factor of the enclosure comprises dimensions that conform to a one rack unit short solid-state drive form factor.
40 . The method of claim 31 , wherein the respective first side of at least one of the first board, the second board, and the third board comprises heat generating electrical components.