Patent Assignment
Reel/Frame 051097/0079
Assignment of Assignor's Interest
Recorded: 2019-11-22
Pages: 4
Assignors
DARMAWIKARTA, KRISTOF
Executed: 2019-06-03
IBRAHIM, TAREK
Executed: 2019-06-04
ALUR, SIDDHARTH
Executed: 2019-06-26
JAIN, RAHUL
Executed: 2019-06-07
CHEN, HAOBO
Executed: 2019-06-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Lithographically Defined Vertical Interconnect Access (via) for a Bridge Die First Level Interconnect (Fli)
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.