WRAP-AROUND LABEL FOR SSD
Systems, apparatuses, and methods may provide for technology for affixing a thermal label to a solid state drive. A printed circuit board of a solid state drive includes a top surface positioned opposite from a back surface. The printed circuit board further include one or more memory chips disposed on the top surface. A thermal label is affixed to the one or more memory chips disposed on the top surface of the printed circuit board and to the back surface of the printed circuit board.
1 . A solid state drive comprising:
a printed circuit board including a top surface positioned opposite from a back surface, the printed circuit board further including one or more memory chips disposed on the top surface; and
a thermal label affixed to the one or more memory chips disposed on the top surface of the printed circuit board and affixed to the back surface of the printed circuit board.
2 . The solid state drive of claim 1 , wherein the printed circuit board further comprises:
a side surface extending perpendicular to the top surface and the back surface; and
a transitional edge extending from the side surface to the back surface.
3 . The solid state drive of claim 2 , wherein the transitional edge is a chamfered edge.
4 . The solid state drive of claim 3 , wherein the printed circuit board further comprises:
a second transitional edge extending from the side surface to the top surface.
5 . The solid state drive of claim 1 , wherein the solid state drive comprises a form factor that does not exceed thirty millimeters.
6 . The solid state drive of claim 1 , further comprising:
a housing including a plurality of sides surrounding an interior region, and wherein the printed circuit board is located within the interior region of the housing.
7 . The solid state drive of claim 1 , wherein the printed circuit board is sized to accommodate application of the thermal layer to the top surface and the back surface of the printed circuit board while maintaining an overall side thickness of the solid state drive consistent with a first form factor.
8 . A system comprising:
a processor; and
a solid state drive coupled to the processor, the solid state drive comprising:
a printed circuit board including a top surface positioned opposite from a back surface, the printed circuit board further including one or more memory chips disposed on the top surface; and
a thermal label affixed to the one or more memory chips disposed on the top surface of the printed circuit board and affixed to the back surface of the printed circuit board.
9 . The system of claim 8 , wherein the printed circuit board further comprises:
a side surface extending perpendicular to the top surface and the back surface; and
a transitional edge extending from the side surface to the back surface.
10 . The system of claim 9 , wherein the transitional edge is a chamfered edge.
11 . The system of claim 10 , wherein the printed circuit board further comprises:
a second transitional edge extending from the side surface to the top surface.
12 . The system of claim 8 , wherein the solid state drive comprises a form factor that does not exceed thirty millimeters.
13 . The system of claim 8 , further comprising:
a housing including a plurality of sides surrounding an interior region, and wherein the printed circuit board is located within the interior region of the housing.
14 . The system of claim 8 , wherein the printed circuit board is sized to accommodate application of the thermal layer to the top surface and the back surface of the printed circuit board while maintaining an overall side thickness of the solid state drive consistent with a first form factor.
15 . A method comprising:
manufacturing a printed circuit board of a solid state drive, the printed circuit board including a top surface positioned opposite from a back surface, the printed circuit board further including one or more memory chips disposed on the top surface; and
affixing a thermal label to the one or more memory chips disposed on the top surface of the printed circuit board and to the back surface of the printed circuit board.
16 . The method of claim 15 , wherein the method further comprises:
forming a transitional edge extending from a side surface of the printed circuit board to the back surface of the printed circuit board, wherein the side surface extends perpendicular to the top surface and the back surface; and
affixing the thermal label to the side surface of the printed circuit board and the transitional edge so as to continuously wrap the thermal label from the top surface of the printed circuit board to the back surface of the printed circuit board.
17 . The method of claim 16 , wherein the transitional edge is a chamfered edge.
18 . The method of claim 17 , wherein the method further comprises:
forming a second transitional edge extending from the side surface to the top surface.
19 . The method of claim 15 , wherein the solid state drive comprises a form factor that does not exceed thirty millimeters.
20 . The method of claim 15 , wherein the printed circuit board is sized to accommodate application of the thermal layer to the top surface and the back surface of the printed circuit board while maintaining an overall side thickness of the solid state drive consistent with a first form factor.