Patent Assignment
Reel/Frame 049302/0370
Assignment of Assignor's Interest
Recorded: 2019-05-29
Pages: 4
Assignors
TIEN, HSI-WEN
Executed: 2019-05-17
LIAO, WEI-HAO
Executed: 2019-05-17
DAI, PIN-REN
Executed: 2019-05-17
LU, CHIH-WEI
Executed: 2019-05-17
LEE, CHUNG-JU
Executed: 2019-05-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming Interconnect Structures Using via Holes Filled with Dielectric Film