Patent Assignment
Reel/Frame 049306/0884
Assignment of Assignor's Interest
Recorded: 2019-05-29
Pages: 3
Assignors
HUANG, KUAN-YU
Executed: 2019-05-02
HUANG, SUNG-HUI
Executed: 2019-05-03
HOU, SHANG-YUN
Executed: 2019-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure and Method for Forming the Same