Patent Assignment
Reel/Frame 049307/0266
Assignment of Assignor's Interest
Recorded: 2019-05-29
Pages: 3
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Method and Substrate Processing Apparatus