Patent Assignment
Reel/Frame 049323/0388
Assignment of Assignor's Interest
Recorded: 2019-05-30
Pages: 6
Assignors
YANG, MANJAE
Executed: 2019-04-24
LEE, JANGWOO
Executed: 2019-04-24
CHO, HWASUK
Executed: 2019-04-24
IHM, JEONGDON
Executed: 2019-04-24
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Interface Chip Used to Select Memory Chip and Storage Device Including Interface Chip and Memory Chip