Patent Assignment
Reel/Frame 049328/0221
Assignment of Assignor's Interest
Recorded: 2019-05-31
Pages: 5
Assignors
LEONG, KEAN HUAT
Executed: 2018-08-09
SEE, CHUN KIT
Executed: 2018-08-09
TAN, SHENG JIAN DARREN
Executed: 2018-08-09
ONG, PAIK WEN
Executed: 2018-08-09
GOH, ENG HUAT
Executed: 2018-08-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Semiconductor Package Substrate Support Structures for Ball-Grid Array Cavities, and Methods of Assembling Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.