Patent Assignment
Reel/Frame 049329/0008
Assignment of Assignor's Interest
Recorded: 2019-05-31
Pages: 4
Assignor
SUK, KYOUNG LIM
Executed: 2019-04-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Method of Fabricating Semiconductor Package and Method of Fabricating Re-Distribution Structure