Patent Assignment
Reel/Frame 049337/0388
Assignment of Assignor's Interest
Recorded: 2019-05-31
Pages: 4
Assignor
YOKOKAWA, ISAO
Executed: 2019-03-15
Assignee
SHIN-ETSU HANDOTAI CO., LTD
2-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Manufacturing Soi Wafer