Patent Assignment
Reel/Frame 049341/0898
Assignment of Assignor's Interest
Recorded: 2019-06-03
Pages: 5
Assignors
TSAI, CHENG-HSIUNG
Executed: 2015-06-16
LEE, CHUNG-JU
Executed: 2015-06-16
SHUE, SHAU-LIN
Executed: 2015-06-16
BAO, TIEN-I
Executed: 2015-06-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Interconnect Structure Having an Etch Stop Layer Over Conductive Lines