Patent Assignment
Reel/Frame 049349/0679
Assignment of Assignor's Interest
Recorded: 2019-06-03
Pages: 3
Assignee
CAREER TECHNOLOGY MFG. CO., LTD.
NO.248, BO-AI ST., SHULIN DIST., NEW TAIPEI CITY, 238, TAIWAN
Covered Property
(1)
Circuit Board Module and Heat-Dissipating Board Structure Thereof