Patent Assignment
Reel/Frame 049351/0738
Assignment of Assignor's Interest
Recorded: 2019-06-03
Pages: 5
Assignors
LEE, SHAO-KUAN
Executed: 2019-05-21
LEE, CHENG-CHIN
Executed: 2019-05-21
HUANG, HSIN-YEN
Executed: 2019-05-21
CHEN, HAI-CHING
Executed: 2019-05-22
SHUE, SHAU-LIN
Executed: 2019-05-22
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Metal Capping Layer and Methods Thereof