Patent Assignment
Reel/Frame 049360/0380
Assignment of Assignor's Interest
Recorded: 2019-06-04
Pages: 6
Assignors
CHO, KEUN YEONG
Executed: 2019-04-22
BYUN, HYUNIL
Executed: 2019-04-22
JI, HO-CHUL
Executed: 2019-04-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Photonic Integrated Circuit Devices and Methods of Forming Same