Patent Assignment
Reel/Frame 049366/0651
Assignment of Assignor's Interest
Recorded: 2019-06-04
Pages: 4
Assignors
CHENG, WEN-HAO
Executed: 2019-05-17
CHEN, YEN-YU
Executed: 2019-05-17
LIN, CHIH-WEI
Executed: 2019-05-17
DAI, YI-MING
Executed: 2019-05-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming the Same