Patent Assignment
Reel/Frame 049367/0629
Assignment of Assignor's Interest
Recorded: 2019-06-04
Pages: 4
Assignors
HU, CHIH-CHIA
Executed: 2019-05-21
CHEN, MING-FA
Executed: 2019-05-21
YEH, SUNG-FENG
Executed: 2019-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming the Same