Patent Assignment
Reel/Frame 049380/0470
Assignment of Assignor's Interest
Recorded: 2019-06-05
Pages: 7
Assignors
MATEJAT, KAI-JENS
Executed: 2019-05-13
LAMPRECHT, SVEN
Executed: 2019-06-04
SPERLING, JAN
Executed: 2019-05-08
OHDE, CHRISTIAN
Executed: 2019-05-07
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Method of Forming a Solderable Solder Deposit on a Contact Pad
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest
Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →