Patent Assignment
Reel/Frame 061521/0103
Release of Security Interest
Recorded: 2022-08-18
Pages: 35
Assignor
GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Executed: 2022-08-17
Assignees
ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH)
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
ATOTECH USA, LLC
1750 OVERVIEW DRIVE, ROCK HILL, SOUTH CAROLINA, 29730
Covered Properties
(261)
Silane Compositions
Patent:
6,215,011 →
Application:
08/376,282 →
Method and Apparatus for Electrolytically Metallising or Etching Material
Patent:
6,176,995 →
Application:
08/674,172 →
Apparatus and Method for Recovering Photoresist Developers and Strippers
Patent:
5,753,135 →
Application:
08/740,025 →
Process for Plating Metal Coatings
Patent:
6,221,440 →
Application:
08/817,337 →
High Current Density Semi- Bright and Bright Zinc Sulfur-Acid Salt Electrogalvanizing Process and Composition
Patent:
5,788,822 →
Application:
08/854,316 →
Method and Device for the Treatment of Plate-Shaped Workpieces Having Small Holes
Patent:
6,016,817 →
Application:
08/888,082 →
Chromate-Plating Bath and Process for Finishing Zinc Zinc Alloy or Cadmium Surfaces
Patent:
5,876,517 →
Application:
08/959,713 →
Computerized Method and System for Designing an Uholstered Part
Patent:
6,144,890 →
Application:
08/962,582 →
Method of Producing Copper Surfaces for Improved Bonding, Compositions Used Therein and Articles Made Therefrom
Patent:
6,284,309 →
Application:
08/994,184 →
Procedure and Device for the Chemical and Electrolytic Treatment of Printed Circuit Boards and Conductor Films
Patent:
6,077,359 →
Application:
09/011,190 →
Film-Stripping Process
Patent:
6,059,919 →
Application:
09/011,253 →
Method and Device for Treating Holes or Recesses Extending into Workpieces with Liquid Treatment Media
Patent:
6,240,934 →
Application:
09/036,107 →
Process for the Electrolytic Deposition of Metal Layers
Patent:
6,099,711 →
Application:
09/066,313 →
Process for Manufacturing Inductive Counting Systems
Patent:
6,120,672 →
Application:
09/068,404 →
Palladium Colloid Solution and Its Utilization
Patent:
6,325,910 →
Application:
09/089,578 →
Process and Circuitry for Generating Current Pulses for Electrolytic Metal Deposition
Patent:
6,132,584 →
Application:
09/091,136 →
Process for Maintaining a Constant Concentration of Substances in an Electroplating Bath
Patent:
6,083,374 →
Application:
09/091,560 →
Removal of Orthophosphite Ions from Electroless Nickel Plating Baths
Patent:
6,048,585 →
Application:
09/101,145 →
Solution for Pretreatment of Electrically Non-Conductive Surfaces, and Method of Coating the Surfaces with Solid Material Particles
Patent:
6,235,182 →
Application:
09/112,880 →
Method and Device for the Electrochemical Treatment with Treatment Liquid of an Item to Be Treated
Patent:
6,071,400 →
Application:
09/162,659 →
Device for Electrochemical Treatment of Elongate Articles
Patent:
6,168,691 →
Application:
09/170,356 →
Aqueous Immersion Plating Bath and Method for Plating
Patent:
6,063,172 →
Application:
09/170,527 →
Process for the Electrolytic Processing Especially of Flat Items and Arrangement for Implementing the Process
Patent:
6,395,163 →
Application:
09/170,601 →
Fluid Delivery Method
Patent:
6,045,874 →
Application:
09/187,595 →
Copper Etching Compositions and Method for Etching Copper
Patent:
6,086,779 →
Application:
09/260,169 →
Circuitry and Method for an Electroplating Plant or Etching Plant Pulse Power Supply
Patent:
6,179,984 →
Application:
09/297,400 →
Process for the Electrolytic Deposition of Copper Layers
Patent:
6,129,830 →
Application:
09/319,423 →
Method and Device for the Precise Electrolytic Deposition and Etching of Metal Layers on Circuit Boards and Conductors Foils in Continuous Systems
Patent:
6,186,316 →
Application:
09/331,099 →
Method and Apparatus for Electrolytically Treating a Board-Shaped Substrate Comprising Shielding Edge Regions of the Substrate During Electrolytic Treatment
Patent:
6,217,736 →
Application:
09/403,397 →
Device for Electrolytic Treatment of Printed Circuit Boards and Conductive Films
Patent:
6,238,529 →
Application:
09/403,657 →
Process for Whisker-Free Aqueous Electroless Tin Plating
Patent:
6,361,823 →
Application:
09/454,023 →
Device and Method for Evening Out the Thickness of Metal Layers on Electrical Contact Points on Items That Are to Be Treated
Patent:
6,319,383 →
Application:
09/485,785 →
Method and Device for Regulating the Concentration of Substances in Electrolytes
Patent:
6,350,362 →
Application:
09/485,786 →
Mounting for a Quartz Crystal
Patent:
6,463,787 →
Application:
09/528,935 →
Method and Solution for Producing Gold Coating
Patent:
6,336,962 →
Application:
09/529,139 →
Photosensitive Composition
Patent:
6,451,498 →
Application:
09/544,309 →
Water Bath and Method for Electrolytic Deposition of Copper Coatings
Patent:
6,425,996 →
Application:
09/581,379 →
Process and Solution for the Preliminary Treatment of Copper Surfaces
Patent:
6,562,149 →
Application:
09/601,494 →
Improved Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,506,314 →
Application:
09/628,036 →
High Current Density Zinc Sulfate Electrogalvanizing Process and Composition
Patent:
6,365,031 →
Application:
09/645,936 →
Agent for Sealing Metallic Ground Coats, Especially Ground Coats Consisting of Zinc or Zinc Alloys
Patent:
6,478,886 →
Application:
09/647,541 →
Method and Device for Electrodialytic Regeneration of an Electroless Metal Deposition Bath
Patent:
6,379,517 →
Application:
09/673,078 →
Method for Producing Metallized Substrate Materials
Patent:
6,706,201 →
Application:
09/673,760 →
Plating Bath and Method for Electroplating Tin-Zinc Alloys
Patent:
6,436,269 →
Application:
09/691,985 →
Process for the Application of a Metal Film on a Polymer Surface of a Subject
Patent:
6,506,293 →
Application:
09/719,802 →
Contact Element for Use in Electroplating
Patent:
6,887,113 →
Application:
09/762,759 →
Method and Device for Partial Electrochemical Treatment of Bar-Shaped Objects
Patent:
6,508,926 →
Application:
09/763,417 →
Composition for desmutting aluminum
Cyanide-Free Aqueous Alkaline Bath Used for the Galvanic Application of Zinc or Zinc-Alloy Coatings
Patent:
6,652,728 →
Application:
09/786,242 →
Method for Galvanically Forming Conductor Structures of High-Purity Copper in the Production of Integrated Circuits
Patent:
6,793,795 →
Application:
09/831,763 →
Process for Plating Metal Coatings
Method for Forming a Metal Pattern on a Dielectric Substrate
Method of Producing Copper Surfaces for Improved Bonding, Compositions Used Therein and Articles Made Therefrom
Method of Producing Copper Surfaces for Improved Bonding, Compositions Used Therein and Articles Made Therefrom
Method for Producing Solderable and Functional Surfaces on Circuit Carriers
Method for Producing Microcomponents
Patent:
6,736,983 →
Application:
09/979,318 →
Metallization of Non-Conductive Surfaces with Silver Catalyst and Electroless Metal Compositions
Tin Whisker-Free Printed Circuit Board
Method of Forming a Conductive Pattern on Dielectric Substrates
Patent:
6,806,034 →
Application:
10/069,417 →
High Current Density Zinc Sulfate Electrogalvanizing Process and Composition
Carrier Serving to Supply Current to Workpieces or Counter-Electrodes That Are to Be Treated Electrolytically and a Method for Electrolytically Treating Workpieces
Patent:
6,695,961 →
Application:
10/088,331 →
Method and Device for the Electrolytic Treatment of Electrically Conducting Structures Which Are Insulated from Each Other and Positioned on the Surface of Electrically Insulating Film Materials and Use of the Method
Patent:
6,979,391 →
Application:
10/110,439 →
Method and Device for the Electrolytic Treatment of Electrically Conducting Surfaces Separated Plates and Film Material Pieces in Addition to Uses of Said Method
Patent:
6,939,455 →
Application:
10/110,570 →
Process for the Preliminary Treatment of Copper Surfaces
Patent:
6,723,385 →
Application:
10/129,705 →
Method and Device for the Regulation of the Concentration of Metal Ions in an Electrolyte and Use Thereof
Electroless Nickel Plating Solutions
Method for Applying a Metal Layer to a Light Metal Surface
Treatment of Circuit Support with Impulse Excitation
Elastic Contact Element
Electrical Contacting Element Made of an Elastic Material
Aqueous Alkaline Zincate Solutions and Methods
Satin-Finished Nickel or Nickel Alloy Coating
Acidic Treatment Liquid and Method of Treating Copper Surfaces
Copper Bath and Methods of Depositing a Matt Copper Coating
Method for Electroless Metal Plating
Direct Electrolytic Metallization on Non-Conducting Substrates
Segmented Counterelectrode for an Electrolytic Treatment System
Method and Conveyorized System for Electorlytically Processing Work Pieces
Conveyorized Plating Line and Method for Electrolytically Metal Plating a Workpiece
Acid Plating Bath and Method for the Electrolytic Deposition of Satin Nickel Deposits
Device and Method for Regenerating an Electroless Metal Plating Bath
Device and Method for Electrolytically Treating an at Least Superficially Electrically Conducting Work Piece
Nozzle Arrangement
Mixture of Oligomeric Phenazinium Compounds and Acid Bath for Electrolytically Depositing a Copper Deposit
Method for Regenerating Etching Solutions Containing Iron for the Use in Etching or Pickling Copper or Copper Alloys and an Apparatus for Carrying Out Said Method
Power Supply Device in a Device for Electrochemical Treatment
Acidic Bath for Electrolytically Depositing a Copper Deposit Containing Halogenated or Pseudohalogenated Monomeric Phenazinium Compounds
Treatment Unit for the Wet-Chemical or Electrolytic Treatment of Flat Workpieces
Method of manufacturing a circuit carrier and the use of the method
Aqueous Acidic Immersion Plating Solutions and Methods for Plating on Aluminum and Aluminum Alloys
Composition and Process for Improving the Adhesion of a Siccative Organic Coating Compositions to Metal Substrates
Articles with Electroplated Zinc-Nickel Ternary and Higher Alloys, Electroplating Baths, Processes and Systems for Electroplating Such Alloys
Iron-Phosphorus Electroplating Bath and Method
Aqueous Alkaline Zincate Solutions and Methods
Metal Pieces and Articles Having Improved Corrosion Resistance
Antifriction Coatings, Methods of Producing Such Coatings and Articles Including Such Coatings
Device and Method for Electrolytically Treating Flat Work Pieces
Device and method for chemically and electrolytically treating work pieces using a conveyor system to transport work pieces between treatment tanks
Fluidized Bed Process for Mixing and Transfer of Powders to Conductive Substrates
Method for Metallizing Insulating Substrates Wherein the Roughening and Etching Processes Are Controlled by Means of Gloss Measurement
Galvanic Process for Filling Through-Holes with Metals, in Particular of Printed Circuit Boards with Copper
Crystalline Chromium Deposit
Method for Continuously Operating Acid or Alkaline Zinc or Zinc Alloy Baths
Process for Cleaning Aluminum and Aluminum Alloy Surfaces with Nitric Acid and Chromic Acid-Free Compositions
Polyvinylammonium Compound, Method of Manufacturing Same, Acidic Solution Containing Said Compound and Method of Electrolytically Depositing a Copper Deposit
Alkaline Electroplating Bath Having a Filtration Membrane
Method, Clip and Device for Transporting an Article to Be Treated in an Electrolytic System
Method of Manufacturing Pattern-Forming Metal Structures on a Carrier Substrate
Aqueous Reaction Solution and Method of Passivating Workpieces Having Zinc or Zinc Alloy Surfaces and Use of a Heteroaromatic Compound
Composition and Method for Improved Adhesion of Polymeric Materials to Copper or Copper Alloy Surfaces
Crystalline Chromium Alloy Deposit
Electrolytic Method For Filling Holes and Cavities With Metals
Metal Plating Composition and Method for the Deposition of Copper-Zinc-Tin Suitable for Manufacturing Thin Film Solar Cell
Electrodeposition method with analysis of the electrolytic bath by solid Phase Extraction
Iron-Phosphorus Electroplating Bath and Method
Chromium(Vi)-Free Black Passivation of Surfaces Containing Zinc
Process for Applying a Metal Coating to a Non-Conductive Substrate
Microbial Degradation of Water-Borne Paint Containing High Levels of Organic Solvent
Agent for the Production of Anti-Corrosion Layers on Metal Surfaces
Vertical System for the Plating Treatment of a Work Piece and Method for Conveying the Work Piece
Apparatus and Method for the Electrolytic Treatment of a Plate-Shaped Product
Apparatus and Method for the Wet Chemical Treatment of a Product and Method for Installing a Flow Member into the Apparatus
Composition and Process for Improved Zincating Magnesium and Magnesium Alloy Substrates
Methods of Treating a Surface to Promote Metal Plating and Devices Formed
Anti-Corrosion Treatment for Conversion Layers
Solution and Process for Increasing the Solderability and Corrosion Resistance of Metal or Metal Alloy Surface
Pyrophosphate-Based Bath for Plating of Tin Alloy Layers
Non-Etching Non-Resist Adhesion Composition and Method of Preparing a Work Piece
Ni-P Layer System and Process for Its Preparation
Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper
Electroplating Additive for the Deposition of Metal, a Binary, Ternary, Quaternary or Pentanary Alloy of Elements of Group 11 (Ib)-Group 13 (Iiia)-Group 16 (Via)
Method and Device for Producing a Plastic Coating
Process for coating a surface of a substrate made of nonmetallic material with a metal layer
Method to Form Solder Deposits on Substrates
Method for Improving the Adhesion Between Silver Surfaces and Resin Materials
Metal Plating Additive, and Method for Plating Substrates and Products Therefrom
Stress-Reduced Ni-P/Pd Stacks for Bondable Wafer Surfaces
Method of Inspecting a Metal Coating and a Method for Analytical Control of a Deposition Electrolyte Serving to Deposit Said Metal Coating
Method for Control of Stabilizer Additives in Electroless Metal and Metal Alloy Plating Electrolytes
Solution and Process for Increasing the Solderability and Corrosion Resistance of a Metal or Metal Alloy Surface
Silicon Solar Cell
Method to Determine the Satin-Effect on Metal Plated Substrates
Method, Holding Means, Apparatus and System for Transporting a Flat Material to Be Treated and Loading or Unloading Apparatus
Method and Assembly for Treating a Planar Material to Be Treated and Device for Removing or Holding Off Treatment Liquid
Method, Treatment Station and Assembly for Treating a Planar Material to Be Treated
Anti-Corrosive Treatment for Surfaces Made of Zinc and Zinc Alloys
Method for Electroless Plating of Tin and Tin Alloys
Treatment Solution for Producing Chrome and Cobalt-Free Black Conversion Coatings
Polymers Having Terminal Amino Groups and Use Thereof as Additives for Zinc and Zinc Alloy Electrodeposition Baths
Membrane Electrolysis Stack, Electrodialysis Device Including the Stack and Method for the Regeneration of an Electroless Plating Bath
Composition and Method for Micro Etching of Copper and Copper Alloys
Process for Forming Corrosion Protection Layers on Metal Surfaces
Method to Form Solder Alloy Deposits on Substrates
Method to Form Solder Deposits on Substrates
Immersion Tin or Tin Alloy Plating Bath with Improved Removal of Cuprous Ions
Solution and Process for the Pre-Treatment of Copper Surfaces Using an N-Alkoxylated Adhesion-Promoting Compound
Process for Etching a Recessed Structure Filled with Tin or a Tin Alloy
Autocatalytic Plating Bath Composition for Deposition of Tin and Tin Alloys
Method for Obtaining a Palladium Surface Finish for Copper Wire Bonding on Printed Circuit Boards and Ic-Substrates
Methods of Treating Metal Surfaces and Devices Formed Thereby
Pyrophosphate-Containing Bath for Cyanide-Free Deposition of Copper-Tin Alloys
Electroplating Bath and Method for Producing Dark Chromium Layers
Method for Electroless Plating
Method for Copper Plating
Wire Bondable Surface for Microelectronic Devices
Electroless Palladium Plating Bath Composition
Composition and Method for Removal of Organic Paint Coatings from Substrates
Novel Adhesion Promoting Agents for Metallization of Substrate Surfaces
Electroless Nickel Plating Bath
Method for Electroless Nickel-Phosphorous Alloy Deposition Onto Flexible Substrates
Method for Manufacture of Fine Line Circuitry
Alkaline Plating Bath for Electroless Deposition of Cobalt Alloys
Process for Metallizing Nonconductive Plastic Surfaces
Process for Metallizing Nonconductive Plastic Surfaces
Method and Apparatus for Electrolytically Depositing a Deposition Metal on a Workpiece
Plating Bath for Electroless Deposition of Nickel Layers
Method for Regenerating a Plating Composition
Galvanic Nickel Electroplating Bath for Depositing a Semi-Bright Nickel
Holding Device for a Product and Treatment Method
Device and Method for the Treatment of Flat Material to Be Treated
Manufacture of Coated Copper Pillars
Method for Manufacture of Wire Bondable and Solderable Surfaces on Noble Metal Electrodes
Process for Coating a Surface of a Substrate Made of Nonmetallic Material with a Metal Layer
Copper Plating Bath Composition
Aqueous Composition for Etching of Copper and Copper Alloys
Process for Corrosion Protection of Iron Containing Materials
Device for Vertical Galvanic Metal, Preferably Copper, Deposition on a Substrate and a Container Suitable for Receiving Such a Device
Plated Electrical Contacts for Solar Modules
Device for Vertical Galvanic Metal Deposition on a Substrate
Method for Depositing a First Metallic Layer Onto Non-Conductive Polymers
Electroless Copper Plating Solution
Method for Activating a Copper Surface for Electroless Plating
Method for Cathodic Corrosion Protection of Chromium Surfaces
Method for Depositing a Copper Seed Layer Onto a Barrier Layer and Copper Plating Bath
Novel Adhesion Promoting Process for Metallisation of Substrate Surfaces
Electroplating Bath and Method for Producing Dark Chromium Layers
Method and Regeneration Apparatus for Regenerating a Plating Composition
Copper Electroplating Method
Pre-Treatment Process for Electroless Plating
Composition and Process for Metallizing Nonconductive Plastic Surfaces
Plating Bath Composition and Method for Electroless Plating of Palladium
Iron Boron Alloy Coatings and a Process for Their Preparation
Method of Forming a Metal Layer and Method of Manufacturing a Substrate Having Such Metal Layer
Galvanic Process for Filling Through-Holes with Metals, in Particular of Printed Circuit Boards with Copper
Methods of Treating Metal Surfaces and Devices Formed Thereby
Solution and Process for the Pre-Treatment of Copper Surfaces Using an N-Alkoxylated Adhesion-Promoting Compound
Method for Reducing the Optical Reflectivity of a Copper and Copper Alloy Circuitry and Touch Screen Device
Electroplating Bath and Method for Producing Dark Chromium Layers
Acidic Zinc and Zinc Nickel Alloy Plating Bath Composition and Electroplating Method
Desmear Module of a Horizontal Process Line and a Method for Separation and Removal of Desmear Particles from Such a Desmear Module
Method for Increasing Adhesion Between a Chromium Surface and a Lacquer
Plating Bath Composition and Method for Electroless Plating of Palladium
Method for Fine Line Manufacturing
Plating Bath Compositions for Electroless Plating of Metals and Metal Alloys
Method and Apparatus for Electroplating a Metal Onto a Substrate
Substrate Holder for Vertical Galvanic Metal Deposition
Substrate Holder Reception Apparatus
Novel Method for Electromagnetic Shielding and Thermal Management of Active Components
Activation Method for Silicon Substrates Comprising at Least Two Aromatic Acids
Electrolytic Copper Plating Bath Compositions and a Method for Their Use
Surface Treatment Composition
3-(Carbamoyl) Pyridinium-1-Yl-Propane-1-Sulfonates Useful in Electroplating Baths
Patent:
9,790,607 →
Application:
15/666,649 →
Method and Apparatus for Electrolytically Depositing a Deposition Metal on a Workpiece
Acidic Zinc or Zinc-Nickel Alloy Electroplating Bath for Depositing a Zinc or Zinc-Nickel Alloy Layer
Imidazoyl Urea Polymers and Their Use in Metal or Metal Alloy Plating Bath Compositions
Aqueous Copper Plating Baths and a Method for Deposition of Copper or Copper Alloy Onto a Substrate
Copper Plating Bath Composition and Method for Deposition of Copper
Method for Galvanic Metal Deposition
Plating Bath Composition for Electroless Plating of Gold and a Method for Depositing a Gold Layer
Application:
15/758,754 →
Publication:
US 2020/0232099
Process for Indium or Indium Alloy Deposition and Article
Method for Monitoring the Total Amount of Sulphur Containing Compounds in a Metal Plating Bath
Plating Bath Composition and Method for Electroless Plating of Palladium
Aqueous Indium or Indium Alloy Plating Bath and Process for Deposition of Indium or an Indium Alloy
A Non-Aqueous Stripping Composition and a Method of Stripping an Organic Coating from a Substrate
Etching Solution for Copper and Copper Alloy Surfaces
Lead-Frame Structure, Lead-Frame, Surface Mount Electronic Device and Methods of Producing Same
Lead-Frame Structure, Lead-Frame, Surface Mount Electronic Device and Methods of Producing Same
Method for Monitoring the Total Amount of Brighteners in an Acidic Copper/Copper Alloy Plating Bath and Controlled Process for Plating
Process for Depositing a Metal or Metal Alloy on a Surface of a Substrate Including Its Activation
Composition and Process for Metallizing Nonconductive Plastic Surfaces
Chrome-Plated Part and Manufacturing Method of the Same
Device for Vertical Galvanic Metal Deposition on a Substrate
Method for Directly Depositing Palladium Onto a Non-Activated Surface of a Gallium Nitride Semiconductor
Wafer-Like Substrate Processing Method and Apparatus
Method for Manufacturing a Printed Circuit Board
Transport Roller
Method of Forming a Solderable Solder Deposit on a Contact Pad
A Method for Electrolytically Passivating an Outermost Chromium or Outermost Chromium Alloy Layer to Increase Corrosion Resistance Thereof
Pyridinium Compounds, a Synthesis Method Therefor, Metal or Metal Alloy Plating Baths Containing Said Pyridinium Compounds and a Method for Use of Said Metal or Metal Alloy Plating Baths
Automated Substrate Holder Loading Device
Controlled Method for Depositing a Chromium or Chromium Alloy Layer on at Least One Substrate
Application:
16/495,122 →
Publication:
US 2020/0017986
Cleaning Solution for Cleaning Metal Surfaces
Method for Electrolytically Depositing a Zinc-Nickel Alloy Layer on at Least a Substrate to Be Treated
A Bath and Method for Filling a Vertical Interconnect Access or Trench of a Work Piece with Nickel or a Nickel Alloy
Method and Apparatus for Electroplating a Metal Onto a Substrate
A Method for Increasing Corrosion Resistance of a Substrate Comprising an Outermost Chromium Alloy Layer
Metal or Metal Alloy Deposition Composition and Plating Compound
Electroless Gold Plating Bath
Aqueous Indium or Indium Alloy Plating Bath and Process for Deposition of Indium or an Indium Alloy
Application:
17/005,693 →
Publication:
US 2020/0392637
A Method for Increasing Adhesion Strength Between a Surface of Copper or Copper Alloy and an Organic Layer
Device for Metal Deposition
Patent:
822,724 →
Application:
29/575,984 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Security Interest
Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest
Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →