Etching solution for copper and copper alloy surfaces
An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R 1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.
1. An aqueous etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions characterised in that the solution further comprises at least one polyamide containing at least one polymeric moiety according to formula (I)
wherein each a is independently from each other selected from 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R 1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups.
2. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that the at least one polyamide containing at least one polymeric moiety according to formula (I) has a mass average molar mass of 1,000 to 500,000 amu.
3. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that the at least one polyamide containing at least one polymeric moiety according to formula (I) has a mass average molar mass of 5,000 to 100,000 amu.
4. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that each R 1 is independently from each other selected from the group consisting of methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, sec-butyl and tert-butyl.
5. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that the at least one polyamide containing at least one polymeric moiety according to formula (I) contains two polymer terminating groups independently from each other selected from the group consisting of hydrogen; hydroxyl; amino; thiol; substituted or unsubstituted C1-C8-alkyl groups; iminoalcohols; aralkyl groups; and aryl groups.
6. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that the at least one polyamide consists of at least one polymeric moiety according to formula (I) and two polymer terminating groups.
7. The etching solution for copper and copper alloy surfaces according to claim 6 characterised in that one polymer terminating group is selected from the group consisting of aralkyl and non-functionalised C1-C8-alkyl groups and the other polymer terminating group is selected from the group consisting of hydrogen, hydroxyl, α-iminoalkan-ω-ol and amino.
8. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that the at least one polymeric moiety according to formula (I) is linear.
9. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that it comprises polyamides containing at least one polymeric moiety according to formula (I) in a total concentration of 1 to 2000 mg/I.
10. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that the at least one oxidising agent suitable to oxidise copper is selected from the group consisting of hydrogen peroxide; metal peroxides; metal superoxides; copper ions and ferric ions.
11. The etching solution for copper and copper alloy surfaces according to claim 10 characterised in that the at least one oxidising agent is selected from the group consisting of copper ions and ferric ions.
12. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that the at least one acid is selected from the group consisting of sulphuric acid, alkyl sulphonic acids, aryl sulphonic acids, nitric acid, phosphoric acid, formic acid, acetic acid, propionic acid and mixtures thereof.
13. The etching solution for copper and copper alloy surfaces according to claim 1 characterised in that the at least one source of halide ions is selected from sources of chloride ions and sources of bromide ions.
14. A method for treating a copper or copper alloy surface according to the invention comprises the steps
(i) providing a substrate comprising at least one copper or copper alloy surface; and
(ii) contacting at least a portion of said copper or copper alloy surface with the etching solution according to claim 1 .
15. The method for treating a copper or copper alloy surface according to claim 14 characterised in that the substrate comprising a copper or copper alloy surface is selected from copper foils, copper alloy foils, printed circuit boards, IC substrates, interposers, copperised semiconductor wafers and copper clad laminates.
16. The etching solution for copper and copper alloy surfaces according to claim 4 characterised in that the at least one polyamide containing at least one polymeric moiety according to formula (I) contains two polymer terminating groups independently from each other selected from the group consisting of hydrogen; hydroxyl; amino; thiol; substituted or unsubstituted C1-C8-alkyl groups; iminoalcohols; aralkyl groups; and aryl groups.