Method for electroless metal plating
View Patent ↗A method for electroless metal plating of substrates, more specifically with electrically non-conductive surfaces, by which the substrates may be reliably metal plated at low cost under manufacturing conditions as well and by means of which it is possible to selectively coat the substrates to be treated only, and not the surfaces of the racks. The method involves the following steps: a. pickling the surfaces with a solution containing chromate ions; b. activating the pickled surfaces with a silver colloid containing stannous ions; c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces; and d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising borane compounds.
1. A method for electroless plating of surfaces comprising the following method steps:
a. pickling the surfaces with a solution containing chromate ions;
b. activating the pickled surfaces with a silver colloid containing stannous ions;
c. treating the activated surfaces with an accelerating solution in order to remove tin compounds from the surfaces wherein the accelerating solution additionally contains methane sulfonate anions;
d. depositing, by means of an electroless nickel plating bath, a layer that substantially consists of nickel to the surfaces treated with the accelerating solution, the electroless nickel plating bath containing at least one reducing agent selected from the group comprising consisting of borane compounds.
2. The method according to claim 1 , wherein the accelerating solution contains fluoride ions.
3. The method according to any one of claims 1 and 2 , wherein the pH of the accelerating solution is at most about 7.
4. The method according to any one of claims 1 and 2 , wherein the pH of the accelerating solution is at most about 2.
5. The method according to any one of claims 1 and 2 , wherein the accelerating solution additionally contains metal ions selected from the group consisting of copper ions, iron ions and cobalt ions.
6. The method according to any one of claims 1 and 2 , wherein the accelerating solution does not contain chloride ions.
7. The method according to any one of claims 1 and 2 , wherein the silver colloid additionally contains methane sulfonate anions.
8. The method according to any one of claims 1 and 2 , wherein the silver colloid additionally contains at least one further reducing agent.
9. The method according to claim 8 , wherein the additionally contained at least one further reducing agent is selected from the group consisting of hydroxyphenyl compounds, hydrazine and derivatives thereof.