Patent Assignment
Reel/Frame 055653/0714
Release of Security Interest
Recorded: 2021-03-18
Pages: 53
Assignor
BARCLAYS BANK PLC, AS COLLATERAL AGENT
Executed: 2021-03-18
Assignees
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, GERMANY
ATOTECH USA, LLC
1750 OVERVIEW DRIVE, ROCK HILL, SOUTH CAROLINA, 29730
Covered Properties
(324)
Device for Masking Field Lines in an Electroplating Plant
Patent:
5,401,370 →
Application:
07/917,022 →
Device for Screening Off Lines of Electric Flux in an Installation for Electrolytically Processing Essentially Flat Elements (Iii)
Patent:
5,391,276 →
Application:
08/108,690 →
Process for the Metallization of Nonconductive Substrates with Elimination of Electroless Metallization
Patent:
5,421,989 →
Application:
08/116,535 →
Acid Bath for the Galvanic Deposition of Copper, and the Use of Such a Bath
Patent:
5,433,840 →
Application:
08/193,016 →
Treatment Method for Cleaning and Drying Printed Circuit Boards and the Like
Patent:
5,494,529 →
Application:
08/199,563 →
Method and Apparatus for Removing Resist Particles from Stripping Solutions for Printed Wireboards
Patent:
5,531,889 →
Application:
08/207,991 →
Skirt for an Air Cushion Vehicle and Filament Member Thereto
Patent:
5,501,291 →
Application:
08/244,791 →
Process for Improving the Coating of Electrolytically Treated Work Pieces, and Arrangement for Carrying Out the Process
Patent:
5,558,757 →
Application:
08/256,231 →
Protection of Lead-Containing Anodes During Chromium Electroplating
Patent:
5,453,175 →
Application:
08/268,476 →
Complex Oligomeric or Polymeric Compounds for the Generation of Metal Seeds on a Substrate
Patent:
5,503,877 →
Application:
08/337,669 →
Silane Compositions
Patent:
6,215,011 →
Application:
08/376,282 →
Solution for Coating Non-Conductors with Conductive Polymers and Their Metallization Process
Patent:
5,597,471 →
Application:
08/387,917 →
Self-Accelerating and Replenishing Non-Formaldehyde Immersion Coating Method
Patent:
5,543,182 →
Application:
08/389,565 →
High Current Density Zinc Chloride Electrogalvanizing Process and Composition
Patent:
5,656,148 →
Application:
08/397,479 →
Aluminum Desmut Composition and Process
Patent:
5,669,980 →
Application:
08/410,498 →
Process for Treating Plastic Surfaces and Swelling Solution
Patent:
5,591,488 →
Application:
08/411,752 →
Apparatus for Removing Resist Particles from Stripping Solutions for Printed Wireboards
Patent:
5,599,444 →
Application:
08/413,760 →
Treatment Method and Apparatus for Printed Circuit Boards and the Like
Patent:
5,553,700 →
Application:
08/419,717 →
Deposition of Chromium Oxides from a Trivalent Chromium Solution Containing a Complexing Agent for a Buffer
Patent:
6,004,448 →
Application:
08/487,437 →
Etchant for Aluminum Alloys
Patent:
5,601,695 →
Application:
08/487,438 →
Process and Apparatus for Electrolytic Deposition of Metal Layers
Patent:
5,976,341 →
Application:
08/507,499 →
Fluid Delivery Apparatus and Method
Patent:
5,614,264 →
Application:
08/514,313 →
Process for Metallization of a Nonconductor Surface
Patent:
5,693,209 →
Application:
08/518,575 →
Apparatus for Treatment of Printed Circuit Boards and the Like
Patent:
5,553,633 →
Application:
08/551,067 →
Halogen Tin Composition and Electrolytic Plating Process
Patent:
5,628,893 →
Application:
08/562,393 →
Multilayer Circuit Boards and Processes of Making the Same
Patent:
5,928,790 →
Application:
08/636,775 →
Method and Apparatus for Electrolytically Metallising or Etching Material
Patent:
6,176,995 →
Application:
08/674,172 →
Acid Bath for Copper Plating and Process with the Use of This Combination
Patent:
5,849,171 →
Application:
08/720,890 →
Device for Processing Flat Workpieces, in Particular Printed Circuit Boards
Patent:
5,772,765 →
Application:
08/737,257 →
Apparatus and Method for Recovering Photoresist Developers and Strippers
Patent:
5,753,135 →
Application:
08/740,025 →
Method and Device for Continuous Uniform Electrolytic Metallising or Etching
Patent:
5,804,052 →
Application:
08/750,314 →
High Current Density Zinc Sulfate Electrogalvanizing Process and Composition
Patent:
5,718,818 →
Application:
08/754,381 →
Etchant for Aluminum Alloys
Patent:
5,895,563 →
Application:
08/773,300 →
Process for Plating Metal Coatings
Patent:
6,221,440 →
Application:
08/817,337 →
Method and Device for Galvanizing Plate-Shaped Products in Horizontal Continuous Plants
Patent:
5,932,081 →
Application:
08/849,413 →
High Current Density Semi- Bright and Bright Zinc Sulfur-Acid Salt Electrogalvanizing Process and Composition
Patent:
5,788,822 →
Application:
08/854,316 →
Method and Device for the Treatment of Plate-Shaped Workpieces Having Small Holes
Patent:
6,016,817 →
Application:
08/888,082 →
Palladium Layers Deposition Process
Patent:
5,882,736 →
Application:
08/914,956 →
Chromate-Plating Bath and Process for Finishing Zinc Zinc Alloy or Cadmium Surfaces
Patent:
5,876,517 →
Application:
08/959,713 →
Computerized Method and System for Designing an Uholstered Part
Patent:
6,144,890 →
Application:
08/962,582 →
Connection Substrate
Patent:
6,321,443 →
Application:
08/973,924 →
Method of Producing Copper Surfaces for Improved Bonding, Compositions Used Therein and Articles Made Therefrom
Patent:
6,284,309 →
Application:
08/994,184 →
Procedure and Device for the Chemical and Electrolytic Treatment of Printed Circuit Boards and Conductor Films
Patent:
6,077,359 →
Application:
09/011,190 →
Film-Stripping Process
Patent:
6,059,919 →
Application:
09/011,253 →
Method and Device for Treating Holes or Recesses Extending into Workpieces with Liquid Treatment Media
Patent:
6,240,934 →
Application:
09/036,107 →
Process for the Electrolytic Deposition of Metal Layers
Patent:
6,099,711 →
Application:
09/066,313 →
Process for Manufacturing Inductive Counting Systems
Patent:
6,120,672 →
Application:
09/068,404 →
Palladium Colloid Solution and Its Utilization
Patent:
6,325,910 →
Application:
09/089,578 →
Process and Circuitry for Generating Current Pulses for Electrolytic Metal Deposition
Patent:
6,132,584 →
Application:
09/091,136 →
Process for Maintaining a Constant Concentration of Substances in an Electroplating Bath
Patent:
6,083,374 →
Application:
09/091,560 →
Removal of Orthophosphite Ions from Electroless Nickel Plating Baths
Patent:
6,048,585 →
Application:
09/101,145 →
Solution for Pretreatment of Electrically Non-Conductive Surfaces, and Method of Coating the Surfaces with Solid Material Particles
Patent:
6,235,182 →
Application:
09/112,880 →
Method and Device for the Electrochemical Treatment with Treatment Liquid of an Item to Be Treated
Patent:
6,071,400 →
Application:
09/162,659 →
Device for Electrochemical Treatment of Elongate Articles
Patent:
6,168,691 →
Application:
09/170,356 →
Aqueous Immersion Plating Bath and Method for Plating
Patent:
6,063,172 →
Application:
09/170,527 →
Process for the Electrolytic Processing Especially of Flat Items and Arrangement for Implementing the Process
Patent:
6,395,163 →
Application:
09/170,601 →
Fluid Delivery Method
Patent:
6,045,874 →
Application:
09/187,595 →
Copper Etching Compositions and Method for Etching Copper
Patent:
6,086,779 →
Application:
09/260,169 →
Circuitry and Method for an Electroplating Plant or Etching Plant Pulse Power Supply
Patent:
6,179,984 →
Application:
09/297,400 →
Process for the Electrolytic Deposition of Copper Layers
Patent:
6,129,830 →
Application:
09/319,423 →
Method and Device for the Precise Electrolytic Deposition and Etching of Metal Layers on Circuit Boards and Conductors Foils in Continuous Systems
Patent:
6,186,316 →
Application:
09/331,099 →
Chemical Microreactors and Method for Producing Same
Patent:
6,409,072 →
Application:
09/380,055 →
Method and Apparatus for Electrolytically Treating a Board-Shaped Substrate Comprising Shielding Edge Regions of the Substrate During Electrolytic Treatment
Patent:
6,217,736 →
Application:
09/403,397 →
Device for Electrolytic Treatment of Printed Circuit Boards and Conductive Films
Patent:
6,238,529 →
Application:
09/403,657 →
Process for Whisker-Free Aqueous Electroless Tin Plating
Patent:
6,361,823 →
Application:
09/454,023 →
Device and Method for Evening Out the Thickness of Metal Layers on Electrical Contact Points on Items That Are to Be Treated
Patent:
6,319,383 →
Application:
09/485,785 →
Method and Device for Regulating the Concentration of Substances in Electrolytes
Patent:
6,350,362 →
Application:
09/485,786 →
Mounting for a Quartz Crystal
Patent:
6,463,787 →
Application:
09/528,935 →
Method and Solution for Producing Gold Coating
Patent:
6,336,962 →
Application:
09/529,139 →
Photosensitive Composition
Patent:
6,451,498 →
Application:
09/544,309 →
Water Bath and Method for Electrolytic Deposition of Copper Coatings
Patent:
6,425,996 →
Application:
09/581,379 →
Process and Solution for the Preliminary Treatment of Copper Surfaces
Patent:
6,562,149 →
Application:
09/601,494 →
Improved Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,506,314 →
Application:
09/628,036 →
High Current Density Zinc Sulfate Electrogalvanizing Process and Composition
Patent:
6,365,031 →
Application:
09/645,936 →
Agent for Sealing Metallic Ground Coats, Especially Ground Coats Consisting of Zinc or Zinc Alloys
Patent:
6,478,886 →
Application:
09/647,541 →
Method and Device for Electrodialytic Regeneration of an Electroless Metal Deposition Bath
Patent:
6,379,517 →
Application:
09/673,078 →
Method for Producing Metallized Substrate Materials
Patent:
6,706,201 →
Application:
09/673,760 →
Plating Bath and Method for Electroplating Tin-Zinc Alloys
Patent:
6,436,269 →
Application:
09/691,985 →
Process for the Application of a Metal Film on a Polymer Surface of a Subject
Patent:
6,506,293 →
Application:
09/719,802 →
Primer for metallizing substrate surfaces
Application:
09/757,810 →
Publication:
US 2002/0001709
Contact Element for Use in Electroplating
Patent:
6,887,113 →
Application:
09/762,759 →
Method and Device for Partial Electrochemical Treatment of Bar-Shaped Objects
Patent:
6,508,926 →
Application:
09/763,417 →
Composition for desmutting aluminum
Cyanide-Free Aqueous Alkaline Bath Used for the Galvanic Application of Zinc or Zinc-Alloy Coatings
Patent:
6,652,728 →
Application:
09/786,242 →
Method for Galvanically Forming Conductor Structures of High-Purity Copper in the Production of Integrated Circuits
Patent:
6,793,795 →
Application:
09/831,763 →
Process for Plating Metal Coatings
Method for Forming a Metal Pattern on a Dielectric Substrate
Method of Producing Copper Surfaces for Improved Bonding, Compositions Used Therein and Articles Made Therefrom
Method of Producing Copper Surfaces for Improved Bonding, Compositions Used Therein and Articles Made Therefrom
Method for Producing Solderable and Functional Surfaces on Circuit Carriers
Method for Producing Microcomponents
Patent:
6,736,983 →
Application:
09/979,318 →
Metallization of Non-Conductive Surfaces with Silver Catalyst and Electroless Metal Compositions
Tin Whisker-Free Printed Circuit Board
Method of Forming a Conductive Pattern on Dielectric Substrates
Patent:
6,806,034 →
Application:
10/069,417 →
High Current Density Zinc Sulfate Electrogalvanizing Process and Composition
Carrier Serving to Supply Current to Workpieces or Counter-Electrodes That Are to Be Treated Electrolytically and a Method for Electrolytically Treating Workpieces
Patent:
6,695,961 →
Application:
10/088,331 →
Method and Device for the Electrolytic Treatment of Electrically Conducting Structures Which Are Insulated from Each Other and Positioned on the Surface of Electrically Insulating Film Materials and Use of the Method
Patent:
6,979,391 →
Application:
10/110,439 →
Method and Device for the Electrolytic Treatment of Electrically Conducting Surfaces Separated Plates and Film Material Pieces in Addition to Uses of Said Method
Patent:
6,939,455 →
Application:
10/110,570 →
Process for the Preliminary Treatment of Copper Surfaces
Patent:
6,723,385 →
Application:
10/129,705 →
Method and Device for the Regulation of the Concentration of Metal Ions in an Electrolyte and Use Thereof
Electroless Nickel Plating Solutions
Method for Applying a Metal Layer to a Light Metal Surface
Treatment of Circuit Support with Impulse Excitation
Elastic Contact Element
Electrical Contacting Element Made of an Elastic Material
Aqueous Alkaline Zincate Solutions and Methods
Satin-Finished Nickel or Nickel Alloy Coating
Cathode for Electrochemical Regeneration of Permanganate Etching Solutions
Method for the treatment of work pieces with a palladium colloid solution
Application:
10/276,351 →
Publication:
US 2003/0155250
Acidic Treatment Liquid and Method of Treating Copper Surfaces
Bath and Method of Electroless Plating of Silver on Metal Surfaces
Microstructure Cooler and Use Thereof
Method of Connecting Module Layers Suitable for the Production of Microstructure Modules and a Microstructure Module
Copper Bath and Methods of Depositing a Matt Copper Coating
Method for Electroless Metal Plating
Nitric acid and chromic acid-free compositions and process for cleaning aluminum and aluminum alloy surfaces
Application:
10/452,111 →
Publication:
US 2004/0242449
Metal pattern formation
Application:
10/469,374 →
Publication:
US 2004/0069636
Direct Electrolytic Metallization on Non-Conducting Substrates
Segmented Counterelectrode for an Electrolytic Treatment System
Method and Conveyorized System for Electorlytically Processing Work Pieces
Precious metal recovery
Application:
10/490,004 →
Publication:
US 2004/0237717
Regeneration method for a plating solution
Application:
10/494,217 →
Publication:
US 2004/0245108
Device and method for transporting flat workpieces in conveyorized processing lines
Application:
10/500,497 →
Publication:
US 2005/0103601
Conveyorized horizontal processing line and method of wet-processing a workpiece
Application:
10/501,492 →
Publication:
US 2005/0076837
Conveyorized Plating Line and Method for Electrolytically Metal Plating a Workpiece
Method for storage of a metal ion supply source in a plating equipment
Application:
10/502,557 →
Publication:
US 2005/0139477
Method and device for treating flat and flexible work pieces
Application:
10/507,137 →
Publication:
US 2005/0224357
Acidic solution for silver deposition and method for silver layer deposition on metal surfaces
Application:
10/513,250 →
Publication:
US 2005/0175780
Acid Plating Bath and Method for the Electrolytic Deposition of Satin Nickel Deposits
Device and method for monitoring an electrolytic process
Application:
10/518,100 →
Publication:
US 2005/0173250
Immersion Plating of Silver
Device and Method for Regenerating an Electroless Metal Plating Bath
Device and Method for Electrolytically Treating an at Least Superficially Electrically Conducting Work Piece
Nozzle Arrangement
Mixture of Oligomeric Phenazinium Compounds and Acid Bath for Electrolytically Depositing a Copper Deposit
Method of electroplating a workpiece having high-aspect ratio holes
Application:
10/544,252 →
Publication:
US 2006/0151328
Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards
Application:
10/550,468 →
Publication:
US 2007/0093620
Solution for etching copper surfaces and method of depositing metal on copper surfaces
Application:
10/550,829 →
Publication:
US 2006/0189141
Method for Regenerating Etching Solutions Containing Iron for the Use in Etching or Pickling Copper or Copper Alloys and an Apparatus for Carrying Out Said Method
Device and method for electrolytically treating electrically insulated structures
Application:
10/566,227 →
Publication:
US 2006/0201817
Aqueous, Acidic Solution and Method for Electrolytically Depositing Copper Coatings as Well as Use of Said Solution
Application:
10/566,913 →
Publication:
US 2008/0142370
Power Supply Device in a Device for Electrochemical Treatment
Acidic Bath for Electrolytically Depositing a Copper Deposit Containing Halogenated or Pseudohalogenated Monomeric Phenazinium Compounds
Device and method for drying a treated product
Application:
10/575,996 →
Publication:
US 2007/0107256
Treatment Unit for the Wet-Chemical or Electrolytic Treatment of Flat Workpieces
Method of manufacturing a circuit carrier and the use of the method
Aqueous Acidic Immersion Plating Solutions and Methods for Plating on Aluminum and Aluminum Alloys
Composition and Process for Improving the Adhesion of a Siccative Organic Coating Compositions to Metal Substrates
Method for micro-roughening treatment of copper and mixed-metal circuitry
Application:
10/675,019 →
Publication:
US 2005/0067378
Apparatus and method for treatment of metal surfaces by inorganic electrophoretic passivation
Application:
10/731,648 →
Publication:
US 2005/0121332
Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom
Application:
10/742,265 →
Publication:
US 2005/0133376
Articles with Electroplated Zinc-Nickel Ternary and Higher Alloys, Electroplating Baths, Processes and Systems for Electroplating Such Alloys
Iron-Phosphorus Electroplating Bath and Method
Aqueous Alkaline Zincate Solutions and Methods
Metal Pieces and Articles Having Improved Corrosion Resistance
Aqueous coating compositions and process for treating metal plated substrates
Application:
11/102,976 →
Publication:
US 2006/0225605
Antifriction Coatings, Methods of Producing Such Coatings and Articles Including Such Coatings
Device and Method for Electrolytically Treating Flat Work Pieces
Translatory Manipulator, Processing Line and Method of Processing Work Pieces
Application:
11/570,460 →
Publication:
US 2009/0000111
Device and method for chemically and electrolytically treating work pieces using a conveyor system to transport work pieces between treatment tanks
Method Of Manufacturing An Electronic Circuit Assembly
Application:
11/572,524 →
Publication:
US 2008/0052904
Fluidized Bed Process for Mixing and Transfer of Powders to Conductive Substrates
Method for Metallizing Insulating Substrates Wherein the Roughening and Etching Processes Are Controlled by Means of Gloss Measurement
Transport device
Application:
11/596,142 →
Publication:
US 2007/0272516
Method for Coating Substrates Containing Antimony Compounds with Tin and Tin Alloys
Application:
11/661,237 →
Publication:
US 2009/0081370
Galvanic Process for Filling Through-Holes with Metals, in Particular of Printed Circuit Boards with Copper
Crystalline Chromium Deposit
Method for Continuously Operating Acid or Alkaline Zinc or Zinc Alloy Baths
Process for Cleaning Aluminum and Aluminum Alloy Surfaces with Nitric Acid and Chromic Acid-Free Compositions
Polyvinylammonium Compound, Method of Manufacturing Same, Acidic Solution Containing Said Compound and Method of Electrolytically Depositing a Copper Deposit
Methods of Treating a Surface to Promote Metal Plating and Devices Formed
Application:
11/848,860 →
Publication:
US 2009/0056994
Alkaline Electroplating Bath Having a Filtration Membrane
Method, Clip and Device for Transporting an Article to Be Treated in an Electrolytic System
Method for Bonding Work pieces and Micro-Structured Component
Application:
11/994,583 →
Publication:
US 2008/0217381
Aqueous Solution and Method for Removing Ionic Contaminants from the Surface of a Workpiece
Application:
11/995,138 →
Publication:
US 2008/0200360
Micro-Structured Cooler and Use Thereof
Microbial Degradation of Water-Borne Paint Containing High Levels of Organic Solvent
Application:
12/021,483 →
Publication:
US 2008/0185337
Method of Manufacturing Pattern-Forming Metal Structures on a Carrier Substrate
Process for Manufacturing a Microreactor and Its Use as a Reformer
Aqueous Reaction Solution and Method of Passivating Workpieces Having Zinc or Zinc Alloy Surfaces and Use of a Heteroaromatic Compound
Composition and Method for Improved Adhesion of Polymeric Materials to Copper or Copper Alloy Surfaces
Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric Material
Application:
12/224,016 →
Publication:
US 2010/0288731
Crystalline Chromium Alloy Deposit
Electrolytic Method For Filling Holes and Cavities With Metals
Metal Plating Composition and Method for the Deposition of Copper-Zinc-Tin Suitable for Manufacturing Thin Film Solar Cell
Method for Bonding Work Pieces Made of Stainless Steel, Nickel or Nickel Alloys, Using a Bonding Layer Consisting of Nickel-Phosphorous, Method for Producing a Micro-Structured Component Using Such Method; Micro-Structured Component Obtained by Such Method
Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings
Application:
12/308,614 →
Publication:
US 2010/0155257
Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings
Application:
12/308,615 →
Publication:
US 2010/0236936
Electrodeposition method with analysis of the electrolytic bath by solid Phase Extraction
Iron-Phosphorus Electroplating Bath and Method
Process for Electrodeposition of Copper Chip to Chip, Chip to Wafer and Wafer to Wafer Interconnects in Through-Silicon Vias (Tsv)
Application:
12/372,113 →
Publication:
US 2010/0206737
Chromium(Vi)-Free Black Passivation of Surfaces Containing Zinc
Process for the Preparation of Electrodes for Use in a Fuel Cell
Application:
12/450,530 →
Publication:
US 2010/0187121
Process for Applying a Metal Coating to a Non-Conductive Substrate
Microbial Degradation of Water-Borne Paint Containing High Levels of Organic Solvent
Agent for the Production of Anti-Corrosion Layers on Metal Surfaces
Vertical System for the Plating Treatment of a Work Piece and Method for Conveying the Work Piece
Apparatus and Method for the Electrolytic Treatment of a Plate-Shaped Product
Apparatus and Method for the Wet Chemical Treatment of a Product and Method for Installing a Flow Member into the Apparatus
Composition and Process for Improved Zincating Magnesium and Magnesium Alloy Substrates
Methods of Treating a Surface to Promote Metal Plating and Devices Formed
Anti-Corrosion Treatment for Conversion Layers
Solution and Process for Increasing the Solderability and Corrosion Resistance of Metal or Metal Alloy Surface
Chrome-Plated Part and Manufacturing Method of the Same
Application:
12/675,002 →
Publication:
US 2011/0117380
Chromium-Free Passivation of Vapor Deposited Aluminum Surfaces
Application:
12/711,431 →
Publication:
US 2011/0206844
Solid Powder Formulations for the Preparation of Resin-Coated Foils and Their Use in the Manufacture of Printed Circuit Boards
Application:
12/747,374 →
Publication:
US 2010/0310849
Process for Electrodeposition of Copper Chip to Chip, Chip to Wafer and Wafer to Wafer Interconnects in Through-Silicon Vias (Tsv) with Heated Substrate and Cooled Electrolyte
Application:
12/845,801 →
Publication:
US 2012/0024713
Pyrophosphate-Based Bath for Plating of Tin Alloy Layers
Pyrophosphate-Containing Bath for Cyanide-Free Deposition of Copper-Tin Alloys
Application:
12/866,996 →
Publication:
US 2010/0326838
Non-Etching Non-Resist Adhesion Composition and Method of Preparing a Work Piece
Ni-P Layer System and Process for Its Preparation
Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper
Method for Electrochemically Depositing a Metal on a Substrate
Application:
12/994,325 →
Publication:
US 2011/0132766
Electroplating Additive for the Deposition of Metal, a Binary, Ternary, Quaternary or Pentanary Alloy of Elements of Group 11 (Ib)-Group 13 (Iiia)-Group 16 (Via)
Method and Device for Producing a Plastic Coating
Method to Form Solder Deposits on Substrates
Post-Treatment Composition for Increasing Corrosion Resistance of Metal and Metal Alloy Surfaces
Application:
13/121,479 →
Publication:
US 2011/0189481
Method for Improving the Adhesion Between Silver Surfaces and Resin Materials
Metal Plating Additive, and Method for Plating Substrates and Products Therefrom
Process and Device for Cleaning Galvanic Baths to Plate Metals
Application:
13/123,934 →
Publication:
US 2011/0210006
Stress-Reduced Ni-P/Pd Stacks for Bondable Wafer Surfaces
Conversion Layers for Surfaces Containing Zinc
Application:
13/125,357 →
Publication:
US 2011/0217476
Method of Inspecting a Metal Coating and a Method for Analytical Control of a Deposition Electrolyte Serving to Deposit Said Metal Coating
Method for Control of Stabilizer Additives in Electroless Metal and Metal Alloy Plating Electrolytes
Solution and Process for Increasing the Solderability and Corrosion Resistance of a Metal or Metal Alloy Surface
Chrome-Plated Part and Manufacturing Method of the Same
Silicon Solar Cell
Pre-Treatment Process for Electroless Nickel Plating
Application:
13/254,239 →
Publication:
US 2012/0321781
Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit Carrier
Application:
13/260,756 →
Publication:
US 2012/0118753
Multilayer Printed Circuit Board Manufacture
Application:
13/265,545 →
Publication:
US 2012/0037312
Method to Determine the Satin-Effect on Metal Plated Substrates
Method, Holding Means, Apparatus and System for Transporting a Flat Material to Be Treated and Loading or Unloading Apparatus
Method and Assembly for Treating a Planar Material to Be Treated and Device for Removing or Holding Off Treatment Liquid
Method, Treatment Station and Assembly for Treating a Planar Material to Be Treated
Anti-Corrosive Treatment for Surfaces Made of Zinc and Zinc Alloys
Method for Electroless Plating of Tin and Tin Alloys
Process for Applying a Metal Coating to a Non-Conductive Substrate
Application:
13/394,165 →
Publication:
US 2012/0160697
Treatment Solution for Producing Chrome and Cobalt-Free Black Conversion Coatings
Polymers Having Terminal Amino Groups and Use Thereof as Additives for Zinc and Zinc Alloy Electrodeposition Baths
Method and Device for the Wet-Chemical Treatment of Material to Be Treated
Application:
13/519,816 →
Publication:
US 2012/0298515
Membrane Electrolysis Stack, Electrodialysis Device Including the Stack and Method for the Regeneration of an Electroless Plating Bath
Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface
Application:
13/578,315 →
Publication:
US 2012/0305406
Composition and Method for Micro Etching of Copper and Copper Alloys
Process for Forming Corrosion Protection Layers on Metal Surfaces
Method for Etching of Copper and Copper Alloys
Application:
13/701,063 →
Publication:
US 2013/0112566
Method to Form Solder Alloy Deposits on Substrates
Method to Form Solder Deposits on Substrates
Method to Form Solder Deposits and Non-Melting Bump Structures on Substrates
Application:
13/808,655 →
Publication:
US 2013/0105329
Method and Arrangement for Depositing a Metal Coating
Application:
13/809,257 →
Publication:
US 2013/0164451
Composite Build-Up Material for Embedding of Circuitry
Application:
13/817,825 →
Publication:
US 2013/0199825
Composite Build-Up Materials for Embedding of Active Components
Application:
13/817,827 →
Publication:
US 2013/0199832
Immersion Tin or Tin Alloy Plating Bath with Improved Removal of Cuprous Ions
Solution and Process for the Pre-Treatment of Copper Surfaces Using an N-Alkoxylated Adhesion-Promoting Compound
Process for Etching a Recessed Structure Filled with Tin or a Tin Alloy
Zinc-Iron Alloy Layer Material
Application:
13/985,294 →
Publication:
US 2013/0316190
Autocatalytic Plating Bath Composition for Deposition of Tin and Tin Alloys
Method for Obtaining a Palladium Surface Finish for Copper Wire Bonding on Printed Circuit Boards and Ic-Substrates
Methods of Treating Metal Surfaces and Devices Formed Thereby
Pyrophosphate-Containing Bath for Cyanide-Free Deposition of Copper-Tin Alloys
Electroplating Bath and Method for Producing Dark Chromium Layers
Aqueous Acidic Bath for Electrolytic Deposition of Copper
Application:
14/114,482 →
Publication:
US 2014/0138252
Method for Electroless Plating
Method for Providing Organic Resist Adhesion to a Copper or Copper Alloy Surface
Application:
14/123,964 →
Publication:
US 2014/0141169
Device and Method for Recovering a Recovering Material from a Recovering Fluid Containing the Recovering Material
Application:
14/124,059 →
Publication:
US 2014/0116950
Method for Copper Plating
Wire Bondable Surface for Microelectronic Devices
Electroless Nickel Plating Bath Composition
Application:
14/131,949 →
Publication:
US 2014/0150689
Chrome-Plated Part and Manufacturing Method of the Same
Formaldehyde-Free Electroless Copper Plating Solution
Application:
14/350,153 →
Publication:
US 2014/0242264
Aqueous Composition for Etching of Copper and Copper Alloys
Application:
14/350,856 →
Publication:
US 2014/0262805
Electroless Palladium Plating Bath Composition
Composition and Method for Removal of Organic Paint Coatings from Substrates
Novel Adhesion Promoting Agents for Metallization of Substrate Surfaces
Method for Combined Through-Hole Plating and via Filling
Application:
14/367,242 →
Publication:
US 2015/0289387
Electroless Nickel Plating Bath
Method for Electroless Nickel-Phosphorous Alloy Deposition Onto Flexible Substrates
Method for Manufacture of Fine Line Circuitry
Method for Producing Matt Copper Deposits
Application:
14/374,000 →
Publication:
US 2015/0014177
Alkaline Plating Bath for Electroless Deposition of Cobalt Alloys
Process for Metallizing Nonconductive Plastic Surfaces
Process for Metallizing Nonconductive Plastic Surfaces
Process for Metallizing Nonconductive Plastic Surfaces
Application:
14/379,502 →
Publication:
US 2015/0064346
Method for Promoting Adhesion Between Dielectric Substrates and Metal Layers
Application:
14/385,779 →
Publication:
US 2015/0050422
Method and Apparatus for Electrolytically Depositing a Deposition Metal on a Workpiece
Plating Bath for Electroless Deposition of Nickel Layers
Process for Metallizing Nonconductive Plastic Surfaces
Application:
14/399,987 →
Publication:
US 2015/0129540
Method for Regenerating a Plating Composition
Composition for Forming a Seed Layer
Application:
14/414,120 →
Publication:
US 2015/0166802
Galvanic Nickel Electroplating Bath for Depositing a Semi-Bright Nickel
Holding Device for a Product and Treatment Method
Device and Method for the Treatment of Flat Material to Be Treated
Method for Metallization of Solar Cell Substrates
Application:
14/427,638 →
Publication:
US 2015/0349152
Manufacture of Coated Copper Pillars
Method for Manufacture of Wire Bondable and Solderable Surfaces on Noble Metal Electrodes
Copper Plating Bath Composition
Aqueous Composition for Etching of Copper and Copper Alloys
Process for Corrosion Protection of Iron Containing Materials
Process for Metallizing Nonconductive Plastic Surfaces
Application:
14/647,499 →
Publication:
US 2015/0307992
Device for Vertical Galvanic Metal, Preferably Copper, Deposition on a Substrate and a Container Suitable for Receiving Such a Device
Plated Electrical Contacts for Solar Modules
Device for Vertical Galvanic Metal Deposition on a Substrate
Method for Depositing a First Metallic Layer Onto Non-Conductive Polymers
Functional Chromium Layer with Improved Corrosion Resistance
Application:
14/765,609 →
Publication:
US 2016/0024674
Apparatus and Method for Electrolytic Deposition of Metal Layers on Workpieces
Application:
14/774,716 →
Publication:
US 2016/0024683
Electroless Copper Plating Solution
Application:
14/777,793 →
Publication:
US 2016/0273112
Electroless Copper Plating Solution
Method for Activating a Copper Surface for Electroless Plating
Method for Depositing Thick Copper Layers Onto Sintered Materials
Application:
14/888,762 →
Publication:
US 2016/0060781
Method for Cathodic Corrosion Protection of Chromium Surfaces
Method for Depositing a Copper Seed Layer Onto a Barrier Layer and Copper Plating Bath
Method for Treatment of Recessed Structures in Dielectric Materials for Smear Removal
Application:
14/912,169 →
Publication:
US 2016/0205783
Novel Adhesion Promoting Process for Metallisation of Substrate Surfaces
Electroplating Bath and Method for Producing Dark Chromium Layers
Method and Regeneration Apparatus for Regenerating a Plating Composition
Method of Selectively Treating Copper in the Presence of Further Metal
Application:
15/021,005 →
Publication:
US 2016/0222519
Novel Adhesion Promoting Agents for Metallisation of Substrate Surfaces
Application:
15/024,043 →
Publication:
US 2016/0237571
Copper Electroplating Method
Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric Material
Application:
15/095,645 →
Publication:
US 2016/0222523
Pre-Treatment Process for Electroless Plating
Galvanic Process for Filling Through-Holes with Metals, in Particular of Printed Circuit Boards with Copper
Display Screen with Graphical User Interface
Patent:
751,592 →
Application:
29/469,429 →
Device for Metal Deposition
Patent:
753,734 →
Application:
29/523,415 →
Device for Metal Deposition
Patent:
822,724 →
Application:
29/575,984 →
Metal Plating Additive, and Method for Plating Substrates and Products Therefrom
Application:
61/106,038 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Security Interest
Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest
Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →