Immersion plating of silver
View Patent ↗The problem in forming solderable and bondable layers on printed circuit boards is that the surfaces tarnish after storage of the boards prior to further processing (mounting of the electrical components), thus affecting solderability and bondability. In order to overcome this problem it is suggested to deposit, in a first method step, a first metal which is more noble than copper to the printed circuit board and to plate silver in a second method step with the proviso that the first metal be deposited at a rate that is at most half the rate of silver in the second method step when the first metal is silver.
1. A method of plating silver on a substrate by a displacement plating reaction provided with a copper surface comprising:
a) depositing silver on the substrate in a first method step, and
b) plating silver on said substrate in a second method step,
wherein silver is deposited in the first method step at a rate that is at most half the rate of plating of silver in the second method step, and
wherein the rate of silver deposition from a silver deposition bath in the first method step is regulated by adjusting at least one deposition parameter and/or by adjusting the composition of the silver bath.
2. The method according to claim 1 , wherein the rate of silver deposition in the first method step is regulated by adjusting the processing temperature.
3. The method according to claim 1 , wherein the rate of deposition of the silver in the first method step is regulated by using a Cu(I) complexing agent in the silver bath.
4. The method according to claim 1 wherein silver is plated in the second method step with a plating bath containing at least one silver halide complex.
5. The method according to claim 4 , wherein the silver halide complex is a silver bromide complex.
6. The method according to claim 1 , wherein silver is plated in the second method step with a bath having a pH ranging from 4 to 6.
7. The method according to claim 1 , wherein silver is plated in the second method step with a plating bath that additionally contains at least one Cu(I) complexing agent.
8. The method according to claim 7 , wherein the at least one Cu(I) complexing agent is selected from the group consisting of 2,2′ bipyridine, 1,10-phenanthrolin, 2,6-bis-[pyridyl-(2)]-pyridine, 2,2′-bichinolin, 2,2-bipyridine-5-carboxylic acid, 2,2′-bipyridine-4,4′-dicarbocylic acid, 4,7-dihydroxyl-1,10-phenanthrolin as well as derivatives thereof.
9. The method according to claim 1 , wherein silver is plated in the second method step with a plating bath that additionally contains at least one Cu(II) complexing agent.
10. The method according to 9 , wherein the at least one Cu(II) complexing agent is selected from the group consisting of ethylene diamine, alanin diacetic acid, amino trimethylene phosphonic acid, diethylene triamine pentamethylene phosphonic acid and 1-hydroxyethylene-1,1-diphosphonic acid.
11. The method according to claim 1 wherein silver is plated in the second method step with a plating bath that additionally contains at least one surface active agent.
12. The method according to claim 1 , wherein the substrate is cleaned and/or etched prior to performing the first method step.
13. The method according to claim 12 , wherein, for cleaning and/or etching, the substrate is contacted with an acidic solution containing at least one peroxo compound selected from the group consisting of alkali peroxo disulfate, alkali caroate and hydrogen peroxide prior to performing the first method step.
14. The method according to claim 1 , wherein the method is carried out as a horizontal conveyorized method.
15. The method according to claim 1 , wherein the substrate is a printed circuit board material and wherein in the second method step silver is plated for subsequently performing a soldering process, a bonding process, for press-fit technology and/or for making electrical contacts.