Patent Assignment
Reel/Frame 041590/0001
Security Interest
Recorded: 2017-02-01
Pages: 57
Assignee
BARCLAYS BANK PLC, AS COLLATERAL AGENT
745 7TH AVENUE, NEW YORK, NEW YORK, 10019
Covered Properties
(323)
Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric Material
Application:
12/224,016 →
Publication:
US US20100288731A1
Metal Plating Additive, and Method for Plating Substrates and Products Therefrom
Application:
61/106,038 →
Chrome-Plated Part and Manufacturing Method of the Same
Pre-Treatment Process for Electroless Nickel Plating
Application:
13/254,239 →
Publication:
US US20120321781A1
Method, Treatment Station and Assembly for Treating a Planar Material to Be Treated
Method of Manufacturing a Circuit Carrier Layer and a Use of Said Method for Manufacturing a Circuit Carrier
Application:
13/260,756 →
Publication:
US US20120118753A1
Membrane Electrolysis Stack, Electrodialysis Device Including the Stack and Method for the Regeneration of an Electroless Plating Bath
Method and Device for the Wet-Chemical Treatment of Material to Be Treated
Application:
13/519,816 →
Publication:
US US20120298515A1
Process for Forming Corrosion Protection Layers on Metal Surfaces
Process and Device for Cleaning Galvanic Baths to Plate Metals
Application:
13/123,934 →
Publication:
US US20110210006A1
Conversion Layers for Surfaces Containing Zinc
Application:
13/125,357 →
Publication:
US US20110217476A1
Zinc-Iron Alloy Layer Material
Application:
13/985,294 →
Publication:
US US20130316190A1
Aqueous Acidic Bath for Electrolytic Deposition of Copper
Application:
14/114,482 →
Publication:
US US20140138252A1
Electroplating Bath and Method for Producing Dark Chromium Layers
Device and Method for Recovering a Recovering Material from a Recovering Fluid Containing the Recovering Material
Application:
14/124,059 →
Publication:
US US20140116950A1
Method for Electroless Plating
Method for Providing Organic Resist Adhesion to a Copper or Copper Alloy Surface
Application:
14/123,964 →
Publication:
US US20140141169A1
Formaldehyde-Free Electroless Copper Plating Solution
Application:
14/350,153 →
Publication:
US US20140242264A1
Composition and Method for Removal of Organic Paint Coatings from Substrates
Methods of Treating Metal Surfaces and Devices Formed Thereby
Method for Combined Through-Hole Plating and via Filling
Application:
14/367,242 →
Publication:
US US20150289387A1
Novel Adhesion Promoting Agents for Metallization of Substrate Surfaces
Method for Manufacture of Fine Line Circuitry
Method for Producing Matt Copper Deposits
Application:
14/374,000 →
Publication:
US US20150014177A1
Process for Metallizing Nonconductive Plastic Surfaces
Application:
14/379,502 →
Publication:
US US20150064346A1
Method for Promoting Adhesion Between Dielectric Substrates and Metal Layers
Application:
14/385,779 →
Publication:
US US20150050422A1
Galvanic Nickel Electroplating Bath for Depositing a Semi-Bright Nickel
Method for Metallization of Solar Cell Substrates
Application:
14/427,638 →
Publication:
US US20150349152A1
Process for Metallizing Nonconductive Plastic Surfaces
Application:
14/647,499 →
Publication:
US US20150307992A1
Device for Vertical Galvanic Metal Deposition on a Substrate
Copper Plating Bath Composition
Plated Electrical Contacts for Solar Modules
Electroless Copper Plating Solution
Method for Depositing a First Metallic Layer Onto Non-Conductive Polymers
Electroless Copper Plating Solution
Application:
14/777,793 →
Publication:
US US20160273112A1
Functional Chromium Layer with Improved Corrosion Resistance
Application:
14/765,609 →
Publication:
US US20160024674A1
Apparatus and Method for Electrolytic Deposition of Metal Layers on Workpieces
Application:
14/774,716 →
Publication:
US US20160024683A1
Method for Depositing Thick Copper Layers Onto Sintered Materials
Application:
14/888,762 →
Publication:
US US20160060781A1
Electroplating Bath and Method for Producing Dark Chromium Layers
Method for Depositing a Copper Seed Layer Onto a Barrier Layer and Copper Plating Bath
Method for Treatment of Recessed Structures in Dielectric Materials for Smear Removal
Application:
14/912,169 →
Publication:
US US20160205783A1
Novel Adhesion Promoting Process for Metallisation of Substrate Surfaces
Novel Adhesion Promoting Agents for Metallisation of Substrate Surfaces
Application:
15/024,043 →
Publication:
US US20160237571A1
Method of Selectively Treating Copper in the Presence of Further Metal
Application:
15/021,005 →
Publication:
US US20160222519A1
Solution and Process to Treat Surfaces of Copper Alloys in Order to Improve the Adhesion Between the Metal Surface and the Bonded Polymeric Material
Application:
15/095,645 →
Publication:
US US20160222523A1
Composition for Forming a Seed Layer
Application:
14/414,120 →
Publication:
US US20150166802A1
Chrome-Plated Part and Manufacturing Method of the Same
Pre-Treatment Process for Electroless Plating
Copper Electroplating Method
Process for Metallizing Nonconductive Plastic Surfaces
Application:
14/399,987 →
Publication:
US US20150129540A1
Aqueous Composition for Etching of Copper and Copper Alloys
Application:
14/350,856 →
Publication:
US US20140262805A1
Electroless Nickel Plating Bath Composition
Application:
14/131,949 →
Publication:
US US20140150689A1
Composite Build-Up Materials for Embedding of Active Components
Application:
13/817,827 →
Publication:
US US20130199832A1
Composite Build-Up Material for Embedding of Circuitry
Application:
13/817,825 →
Publication:
US US20130199825A1
Method and Arrangement for Depositing a Metal Coating
Application:
13/809,257 →
Publication:
US US20130164451A1
Method to Form Solder Deposits and Non-Melting Bump Structures on Substrates
Application:
13/808,655 →
Publication:
US US20130105329A1
Method for Etching of Copper and Copper Alloys
Application:
13/701,063 →
Publication:
US US20130112566A1
Method for Metallising Objects Which Have at Least Two Different Plastics on the Surface
Application:
13/578,315 →
Publication:
US US20120305406A1
Process for Applying a Metal Coating to a Non-Conductive Substrate
Application:
13/394,165 →
Publication:
US US20120160697A1
Multilayer Printed Circuit Board Manufacture
Application:
13/265,545 →
Publication:
US US20120037312A1
Post-Treatment Composition for Increasing Corrosion Resistance of Metal and Metal Alloy Surfaces
Application:
13/121,479 →
Publication:
US US20110189481A1
Method for Electrochemically Depositing a Metal on a Substrate
Application:
12/994,325 →
Publication:
US US20110132766A1
Pyrophosphate-Containing Bath for Cyanide-Free Deposition of Copper-Tin Alloys
Application:
12/866,996 →
Publication:
US US20100326838A1
Process for Electrodeposition of Copper Chip to Chip, Chip to Wafer and Wafer to Wafer Interconnects in Through-Silicon Vias (Tsv) with Heated Substrate and Cooled Electrolyte
Application:
12/845,801 →
Publication:
US US20120024713A1
Solid Powder Formulations for the Preparation of Resin-Coated Foils and Their Use in the Manufacture of Printed Circuit Boards
Application:
12/747,374 →
Publication:
US US20100310849A1
Chromium-Free Passivation of Vapor Deposited Aluminum Surfaces
Application:
12/711,431 →
Publication:
US US20110206844A1
Chrome-Plated Part and Manufacturing Method of the Same
Application:
12/675,002 →
Publication:
US US20110117380A1
Process for the Preparation of Electrodes for Use in a Fuel Cell
Application:
12/450,530 →
Publication:
US US20100187121A1
Process for Electrodeposition of Copper Chip to Chip, Chip to Wafer and Wafer to Wafer Interconnects in Through-Silicon Vias (Tsv)
Application:
12/372,113 →
Publication:
US US20100206737A1
Aqueous,alkaline,cyanide-free bath for the galvanic deposition of zinc and zinc alloy coatings
Application:
12/308,615 →
Publication:
US US20100236936A1
Aqueous, alkaline, cyanide-free bath for the galvanic deposition of zinc alloy coatings
Application:
12/308,614 →
Publication:
US US20100155257A1
Microbial Degradation of Water-Borne Paint Containing High Levels of Organic Solvent
Application:
12/021,483 →
Publication:
US US20080185337A1
Aqueous Solution and Method for Removing Ionic Contaminants from the Surface of a Workpiece
Application:
11/995,138 →
Publication:
US US20080200360A1
Method for Bonding Work pieces and Micro-Structured Component
Application:
11/994,583 →
Publication:
US US20080217381A1
Methods of Treating a Surface to Promote Metal Plating and Devices Formed
Application:
11/848,860 →
Publication:
US US20090056994A1
Method for Coating Substrates Containing Antimony Compounds with Tin and Tin Alloys
Application:
11/661,237 →
Publication:
US US20090081370A1
Transport device
Application:
11/596,142 →
Publication:
US US20070272516A1
Method Of Manufacturing An Electronic Circuit Assembly
Application:
11/572,524 →
Publication:
US US20080052904A1
Translatory Manipulator, Processing Line and Method of Processing Work Pieces
Application:
11/570,460 →
Publication:
US US20090000111A1
Aqueous coating compositions and process for treating metal plated substrates
Application:
11/102,976 →
Publication:
US US20060225605A1
Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom
Application:
10/742,265 →
Publication:
US US20050133376A1
Apparatus and method for treatment of metal surfaces by inorganic electrophoretic passivation
Application:
10/731,648 →
Publication:
US US20050121332A1
Method for micro-roughening treatment of copper and mixed-metal circuitry
Application:
10/675,019 →
Publication:
US US20050067378A1
Device and method for drying a treated product
Application:
10/575,996 →
Publication:
US US20070107256A1
Aqueous, Acidic Solution and Method for Electrolytically Depositing Copper Coatings as Well as Use of Said Solution
Application:
10/566,913 →
Publication:
US US20080142370A1
Device and method for electrolytically treating electrically insulated structures
Application:
10/566,227 →
Publication:
US US20060201817A1
Solution for etching copper surfaces and method of depositing metal on copper surfaces
Application:
10/550,829 →
Publication:
US US20060189141A1
Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards
Application:
10/550,468 →
Publication:
US US20070093620A1
Method of electroplating a workpiece having high-aspect ratio holes
Application:
10/544,252 →
Publication:
US US20060151328A1
Device and method for monitoring an electrolytic process
Application:
10/518,100 →
Publication:
US US20050173250A1
Acidic solution for silver deposition and method for silver layer deposition on metal surfaces
Application:
10/513,250 →
Publication:
US US20050175780A1
Method and device for treating flat and flexible work pieces
Application:
10/507,137 →
Publication:
US US20050224357A1
Method for storage of a metal ion supply source in a plating equipment
Application:
10/502,557 →
Publication:
US US20050139477A1
Conveyorized horizontal processing line and method of wet-processing a workpiece
Application:
10/501,492 →
Publication:
US US20050076837A1
Device and method for transporting flat workpieces in conveyorized processing lines
Application:
10/500,497 →
Publication:
US US20050103601A1
Regeneration method for a plating solution
Application:
10/494,217 →
Publication:
US US20040245108A1
Precious metal recovery
Application:
10/490,004 →
Publication:
US US20040237717A1
Metal pattern formation
Application:
10/469,374 →
Publication:
US US20040069636A1
Nitric acid and chromic acid-free compositions and process for cleaning aluminum and aluminum alloy surfaces
Application:
10/452,111 →
Publication:
US US20040242449A1
Method for the treatment of work pieces with a palladium colloid solution
Application:
10/276,351 →
Publication:
US US20030155250A1
Primer for metallizing substrate surfaces
Application:
09/757,810 →
Publication:
US US20020001709A1
Device for Metal Deposition
Patent:
822,724 →
Application:
29/575,984 →
Palladium Layers Deposition Process
Patent:
5,882,736 →
Application:
08/914,956 →
Process and Apparatus for Electrolytic Deposition of Metal Layers
Patent:
5,976,341 →
Application:
08/507,499 →
Contact Element for Use in Electroplating
Patent:
6,887,113 →
Application:
09/762,759 →
Cyanide-Free Aqueous Alkaline Bath Used for the Galvanic Application of Zinc or Zinc-Alloy Coatings
Patent:
6,652,728 →
Application:
09/786,242 →
Film-Stripping Process
Patent:
6,059,919 →
Application:
09/011,253 →
Process for the Electrolytic Deposition of Metal Layers
Patent:
6,099,711 →
Application:
09/066,313 →
Process for Maintaining a Constant Concentration of Substances in an Electroplating Bath
Patent:
6,083,374 →
Application:
09/091,560 →
Device for Electrochemical Treatment of Elongate Articles
Patent:
6,168,691 →
Application:
09/170,356 →
Water Bath and Method for Electrolytic Deposition of Copper Coatings
Patent:
6,425,996 →
Application:
09/581,379 →
Process and Solution for the Preliminary Treatment of Copper Surfaces
Patent:
6,562,149 →
Application:
09/601,494 →
Method and Device for Partial Electrochemical Treatment of Bar-Shaped Objects
Patent:
6,508,926 →
Application:
09/763,417 →
Process for the Electrolytic Deposition of Copper Layers
Patent:
6,129,830 →
Application:
09/319,423 →
Chemical Microreactors and Method for Producing Same
Patent:
6,409,072 →
Application:
09/380,055 →
Process for the Preliminary Treatment of Copper Surfaces
Patent:
6,723,385 →
Application:
10/129,705 →
Cathode for Electrochemical Regeneration of Permanganate Etching Solutions
Method for Applying a Metal Layer to a Light Metal Surface
Electrical Contacting Element Made of an Elastic Material
Elastic Contact Element
Method of Connecting Module Layers Suitable for the Production of Microstructure Modules and a Microstructure Module
Satin-Finished Nickel or Nickel Alloy Coating
Acidic Treatment Liquid and Method of Treating Copper Surfaces
Bath and Method of Electroless Plating of Silver on Metal Surfaces
Copper Bath and Methods of Depositing a Matt Copper Coating
Method for Electroless Metal Plating
Vertical System for the Plating Treatment of a Work Piece and Method for Conveying the Work Piece
Apparatus and Method for the Wet Chemical Treatment of a Product and Method for Installing a Flow Member into the Apparatus
Segmented Counterelectrode for an Electrolytic Treatment System
Method and Conveyorized System for Electorlytically Processing Work Pieces
Microstructure Cooler and Use Thereof
Aqueous Alkaline Zincate Solutions and Methods
Aqueous Acidic Immersion Plating Solutions and Methods for Plating on Aluminum and Aluminum Alloys
Composition and Process for Improving the Adhesion of a Siccative Organic Coating Compositions to Metal Substrates
Articles with Electroplated Zinc-Nickel Ternary and Higher Alloys, Electroplating Baths, Processes and Systems for Electroplating Such Alloys
Iron-Phosphorus Electroplating Bath and Method
Chromate-Plating Bath and Process for Finishing Zinc Zinc Alloy or Cadmium Surfaces
Patent:
5,876,517 →
Application:
08/959,713 →
Composition for desmutting aluminum
Process for Manufacturing a Microreactor and Its Use as a Reformer
Multilayer Circuit Boards and Processes of Making the Same
Patent:
5,928,790 →
Application:
08/636,775 →
Aqueous Immersion Plating Bath and Method for Plating
Patent:
6,063,172 →
Application:
09/170,527 →
Copper Etching Compositions and Method for Etching Copper
Patent:
6,086,779 →
Application:
09/260,169 →
Process for Whisker-Free Aqueous Electroless Tin Plating
Patent:
6,361,823 →
Application:
09/454,023 →
Improved Adhesion of Polymeric Materials to Metal Surfaces
Patent:
6,506,314 →
Application:
09/628,036 →
Plating Bath and Method for Electroplating Tin-Zinc Alloys
Patent:
6,436,269 →
Application:
09/691,985 →
Conveyorized Plating Line and Method for Electrolytically Metal Plating a Workpiece
Method and Device for the Regulation of the Concentration of Metal Ions in an Electrolyte and Use Thereof
Aqueous Reaction Solution and Method of Passivating Workpieces Having Zinc or Zinc Alloy Surfaces and Use of a Heteroaromatic Compound
Device for Electrolytic Treatment of Printed Circuit Boards and Conductive Films
Patent:
6,238,529 →
Application:
09/403,657 →
Method and Device for Regulating the Concentration of Substances in Electrolytes
Patent:
6,350,362 →
Application:
09/485,786 →
Device and method for chemically and electrolytically treating work pieces using a conveyor system to transport work pieces between treatment tanks
Device and Method for Electrolytically Treating Flat Work Pieces
Direct Electrolytic Metallization on Non-Conducting Substrates
Polyvinylammonium Compound, Method of Manufacturing Same, Acidic Solution Containing Said Compound and Method of Electrolytically Depositing a Copper Deposit
Anti-Corrosion Treatment for Conversion Layers
Solution and Process for Increasing the Solderability and Corrosion Resistance of Metal or Metal Alloy Surface
Non-Etching Non-Resist Adhesion Composition and Method of Preparing a Work Piece
Aqueous, Acid Bath and Method for the Electrolytic Deposition of Copper
Aqueous Alkaline Zincate Solutions and Methods
Composition and Method for Improved Adhesion of Polymeric Materials to Copper or Copper Alloy Surfaces
Agent for the Production of Anti-Corrosion Layers on Metal Surfaces
Apparatus and Method for the Electrolytic Treatment of a Plate-Shaped Product
Electroless Nickel Plating Solutions
Immersion Plating of Silver
Composition and Process for Improved Zincating Magnesium and Magnesium Alloy Substrates
Iron-Phosphorus Electroplating Bath and Method
Method for Regenerating Etching Solutions Containing Iron for the Use in Etching or Pickling Copper or Copper Alloys and an Apparatus for Carrying Out Said Method
Fluidized Bed Process for Mixing and Transfer of Powders to Conductive Substrates
Electrolytic Method For Filling Holes and Cavities With Metals
Method for Bonding Work Pieces Made of Stainless Steel, Nickel or Nickel Alloys, Using a Bonding Layer Consisting of Nickel-Phosphorous, Method for Producing a Micro-Structured Component Using Such Method; Micro-Structured Component Obtained by Such Method
Crystalline Chromium Alloy Deposit
Power Supply Device in a Device for Electrochemical Treatment
Method for Metallizing Insulating Substrates Wherein the Roughening and Etching Processes Are Controlled by Means of Gloss Measurement
Agent for Sealing Metallic Ground Coats, Especially Ground Coats Consisting of Zinc or Zinc Alloys
Patent:
6,478,886 →
Application:
09/647,541 →
Device and Method for Electrolytically Treating an at Least Superficially Electrically Conducting Work Piece
Method for Continuously Operating Acid or Alkaline Zinc or Zinc Alloy Baths
Crystalline Chromium Deposit
Process for Cleaning Aluminum and Aluminum Alloy Surfaces with Nitric Acid and Chromic Acid-Free Compositions
Metal Plating Composition and Method for the Deposition of Copper-Zinc-Tin Suitable for Manufacturing Thin Film Solar Cell
Electrodeposition method with analysis of the electrolytic bath by solid Phase Extraction
Acidic Bath for Electrolytically Depositing a Copper Deposit Containing Halogenated or Pseudohalogenated Monomeric Phenazinium Compounds
Treatment Unit for the Wet-Chemical or Electrolytic Treatment of Flat Workpieces
Method of manufacturing a circuit carrier and the use of the method
Alkaline Electroplating Bath Having a Filtration Membrane
Method, Clip and Device for Transporting an Article to Be Treated in an Electrolytic System
Method and Device for Electrodialytic Regeneration of an Electroless Metal Deposition Bath
Patent:
6,379,517 →
Application:
09/673,078 →
Nozzle Arrangement
Mixture of Oligomeric Phenazinium Compounds and Acid Bath for Electrolytically Depositing a Copper Deposit
Chromium(Vi)-Free Black Passivation of Surfaces Containing Zinc
Microbial Degradation of Water-Borne Paint Containing High Levels of Organic Solvent
Antifriction Coatings, Methods of Producing Such Coatings and Articles Including Such Coatings
Method of Manufacturing Pattern-Forming Metal Structures on a Carrier Substrate
Micro-Structured Cooler and Use Thereof
Process for Applying a Metal Coating to a Non-Conductive Substrate
Methods of Treating a Surface to Promote Metal Plating and Devices Formed
Metal Plating Additive, and Method for Plating Substrates and Products Therefrom
Method and Assembly for Treating a Planar Material to Be Treated and Device for Removing or Holding Off Treatment Liquid
Silicon Solar Cell
Method to Determine the Satin-Effect on Metal Plated Substrates
Anti-Corrosive Treatment for Surfaces Made of Zinc and Zinc Alloys
Acid Plating Bath and Method for the Electrolytic Deposition of Satin Nickel Deposits
Device and Method for Regenerating an Electroless Metal Plating Bath
Polymers Having Terminal Amino Groups and Use Thereof as Additives for Zinc and Zinc Alloy Electrodeposition Baths
Treatment Solution for Producing Chrome and Cobalt-Free Black Conversion Coatings
Pyrophosphate-Based Bath for Plating of Tin Alloy Layers
Ni-P Layer System and Process for Its Preparation
Electroplating Additive for the Deposition of Metal, a Binary, Ternary, Quaternary or Pentanary Alloy of Elements of Group 11 (Ib)-Group 13 (Iiia)-Group 16 (Via)
Method and Device for Producing a Plastic Coating
Composition and Method for Micro Etching of Copper and Copper Alloys
Stress-Reduced Ni-P/Pd Stacks for Bondable Wafer Surfaces
Method for Improving the Adhesion Between Silver Surfaces and Resin Materials
Method to Form Solder Alloy Deposits on Substrates
Method to Form Solder Deposits on Substrates
Method of Inspecting a Metal Coating and a Method for Analytical Control of a Deposition Electrolyte Serving to Deposit Said Metal Coating
Method to Form Solder Deposits on Substrates
Method for Control of Stabilizer Additives in Electroless Metal and Metal Alloy Plating Electrolytes
Solution and Process for Increasing the Solderability and Corrosion Resistance of a Metal or Metal Alloy Surface
Immersion Tin or Tin Alloy Plating Bath with Improved Removal of Cuprous Ions
Autocatalytic Plating Bath Composition for Deposition of Tin and Tin Alloys
Method for Obtaining a Palladium Surface Finish for Copper Wire Bonding on Printed Circuit Boards and Ic-Substrates
Process for Etching a Recessed Structure Filled with Tin or a Tin Alloy
Wire Bondable Surface for Microelectronic Devices
Electroless Palladium Plating Bath Composition
Method for Electroless Nickel-Phosphorous Alloy Deposition Onto Flexible Substrates
Process for Metallizing Nonconductive Plastic Surfaces
Process for Metallizing Nonconductive Plastic Surfaces
Alkaline Plating Bath for Electroless Deposition of Cobalt Alloys
Method for Regenerating a Plating Composition
Plating Bath for Electroless Deposition of Nickel Layers
Holding Device for a Product and Treatment Method
Manufacture of Coated Copper Pillars
Metal Pieces and Articles Having Improved Corrosion Resistance
High Current Density Semi- Bright and Bright Zinc Sulfur-Acid Salt Electrogalvanizing Process and Composition
Patent:
5,788,822 →
Application:
08/854,316 →
Apparatus and Method for Recovering Photoresist Developers and Strippers
Patent:
5,753,135 →
Application:
08/740,025 →
Silane Compositions
Patent:
6,215,011 →
Application:
08/376,282 →
Display Screen with Graphical User Interface
Patent:
751,592 →
Application:
29/469,429 →
Device for Metal Deposition
Patent:
753,734 →
Application:
29/523,415 →
Galvanic Process for Filling Through-Holes with Metals, in Particular of Printed Circuit Boards with Copper
Method and Regeneration Apparatus for Regenerating a Plating Composition
Method for Cathodic Corrosion Protection of Chromium Surfaces
Method for Activating a Copper Surface for Electroless Plating
Device for Vertical Galvanic Metal, Preferably Copper, Deposition on a Substrate and a Container Suitable for Receiving Such a Device
Process for Corrosion Protection of Iron Containing Materials
Aqueous Composition for Etching of Copper and Copper Alloys
Method for Manufacture of Wire Bondable and Solderable Surfaces on Noble Metal Electrodes
Device and Method for the Treatment of Flat Material to Be Treated
Electroless Nickel Plating Bath
Method for Copper Plating
Solution and Process for the Pre-Treatment of Copper Surfaces Using an N-Alkoxylated Adhesion-Promoting Compound
Method for Electroless Plating of Tin and Tin Alloys
Galvanic Process for Filling Through-Holes with Metals, in Particular of Printed Circuit Boards with Copper
Pyrophosphate-Containing Bath for Cyanide-Free Deposition of Copper-Tin Alloys
Method, Holding Means, Apparatus and System for Transporting a Flat Material to Be Treated and Loading or Unloading Apparatus
Method and Device for the Electrolytic Treatment of Electrically Conducting Structures Which Are Insulated from Each Other and Positioned on the Surface of Electrically Insulating Film Materials and Use of the Method
Patent:
6,979,391 →
Application:
10/110,439 →
Method and Device for the Electrolytic Treatment of Electrically Conducting Surfaces Separated Plates and Film Material Pieces in Addition to Uses of Said Method
Patent:
6,939,455 →
Application:
10/110,570 →
Treatment of Circuit Support with Impulse Excitation
Method of Forming a Conductive Pattern on Dielectric Substrates
Patent:
6,806,034 →
Application:
10/069,417 →
Method for Galvanically Forming Conductor Structures of High-Purity Copper in the Production of Integrated Circuits
Patent:
6,793,795 →
Application:
09/831,763 →
Method for Producing Microcomponents
Patent:
6,736,983 →
Application:
09/979,318 →
Tin Whisker-Free Printed Circuit Board
Method for Producing Metallized Substrate Materials
Patent:
6,706,201 →
Application:
09/673,760 →
Method for Producing Solderable and Functional Surfaces on Circuit Carriers
Carrier Serving to Supply Current to Workpieces or Counter-Electrodes That Are to Be Treated Electrolytically and a Method for Electrolytically Treating Workpieces
Patent:
6,695,961 →
Application:
10/088,331 →
Metallization of Non-Conductive Surfaces with Silver Catalyst and Electroless Metal Compositions
Method of Producing Copper Surfaces for Improved Bonding, Compositions Used Therein and Articles Made Therefrom
Method for Forming a Metal Pattern on a Dielectric Substrate
High Current Density Zinc Sulfate Electrogalvanizing Process and Composition
Method of Producing Copper Surfaces for Improved Bonding, Compositions Used Therein and Articles Made Therefrom
Process for the Application of a Metal Film on a Polymer Surface of a Subject
Patent:
6,506,293 →
Application:
09/719,802 →
Mounting for a Quartz Crystal
Patent:
6,463,787 →
Application:
09/528,935 →
Photosensitive Composition
Patent:
6,451,498 →
Application:
09/544,309 →
Process for Plating Metal Coatings
Process for the Electrolytic Processing Especially of Flat Items and Arrangement for Implementing the Process
Patent:
6,395,163 →
Application:
09/170,601 →
High Current Density Zinc Sulfate Electrogalvanizing Process and Composition
Patent:
6,365,031 →
Application:
09/645,936 →
Method and Solution for Producing Gold Coating
Patent:
6,336,962 →
Application:
09/529,139 →
Palladium Colloid Solution and Its Utilization
Patent:
6,325,910 →
Application:
09/089,578 →
Connection Substrate
Patent:
6,321,443 →
Application:
08/973,924 →
Device and Method for Evening Out the Thickness of Metal Layers on Electrical Contact Points on Items That Are to Be Treated
Patent:
6,319,383 →
Application:
09/485,785 →
Method of Producing Copper Surfaces for Improved Bonding, Compositions Used Therein and Articles Made Therefrom
Patent:
6,284,309 →
Application:
08/994,184 →
Method and Device for Treating Holes or Recesses Extending into Workpieces with Liquid Treatment Media
Patent:
6,240,934 →
Application:
09/036,107 →
Solution for Pretreatment of Electrically Non-Conductive Surfaces, and Method of Coating the Surfaces with Solid Material Particles
Patent:
6,235,182 →
Application:
09/112,880 →
Process for Plating Metal Coatings
Patent:
6,221,440 →
Application:
08/817,337 →
Method and Apparatus for Electrolytically Treating a Board-Shaped Substrate Comprising Shielding Edge Regions of the Substrate During Electrolytic Treatment
Patent:
6,217,736 →
Application:
09/403,397 →
Method and Device for the Precise Electrolytic Deposition and Etching of Metal Layers on Circuit Boards and Conductors Foils in Continuous Systems
Patent:
6,186,316 →
Application:
09/331,099 →
Circuitry and Method for an Electroplating Plant or Etching Plant Pulse Power Supply
Patent:
6,179,984 →
Application:
09/297,400 →
Method and Apparatus for Electrolytically Metallising or Etching Material
Patent:
6,176,995 →
Application:
08/674,172 →
Computerized Method and System for Designing an Uholstered Part
Patent:
6,144,890 →
Application:
08/962,582 →
Process and Circuitry for Generating Current Pulses for Electrolytic Metal Deposition
Patent:
6,132,584 →
Application:
09/091,136 →
Process for Manufacturing Inductive Counting Systems
Patent:
6,120,672 →
Application:
09/068,404 →
Procedure and Device for the Chemical and Electrolytic Treatment of Printed Circuit Boards and Conductor Films
Patent:
6,077,359 →
Application:
09/011,190 →
Method and Device for the Electrochemical Treatment with Treatment Liquid of an Item to Be Treated
Patent:
6,071,400 →
Application:
09/162,659 →
Removal of Orthophosphite Ions from Electroless Nickel Plating Baths
Patent:
6,048,585 →
Application:
09/101,145 →
Fluid Delivery Method
Patent:
6,045,874 →
Application:
09/187,595 →
Method and Device for the Treatment of Plate-Shaped Workpieces Having Small Holes
Patent:
6,016,817 →
Application:
08/888,082 →
Deposition of Chromium Oxides from a Trivalent Chromium Solution Containing a Complexing Agent for a Buffer
Patent:
6,004,448 →
Application:
08/487,437 →
Method and Device for Galvanizing Plate-Shaped Products in Horizontal Continuous Plants
Patent:
5,932,081 →
Application:
08/849,413 →
Etchant for Aluminum Alloys
Patent:
5,895,563 →
Application:
08/773,300 →
Acid Bath for Copper Plating and Process with the Use of This Combination
Patent:
5,849,171 →
Application:
08/720,890 →
Method and Device for Continuous Uniform Electrolytic Metallising or Etching
Patent:
5,804,052 →
Application:
08/750,314 →
Device for Processing Flat Workpieces, in Particular Printed Circuit Boards
Patent:
5,772,765 →
Application:
08/737,257 →
High Current Density Zinc Sulfate Electrogalvanizing Process and Composition
Patent:
5,718,818 →
Application:
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Process for Metallization of a Nonconductor Surface
Patent:
5,693,209 →
Application:
08/518,575 →
Aluminum Desmut Composition and Process
Patent:
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Application:
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High Current Density Zinc Chloride Electrogalvanizing Process and Composition
Patent:
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Application:
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Halogen Tin Composition and Electrolytic Plating Process
Patent:
5,628,893 →
Application:
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Fluid Delivery Apparatus and Method
Patent:
5,614,264 →
Application:
08/514,313 →
Etchant for Aluminum Alloys
Patent:
5,601,695 →
Application:
08/487,438 →
Apparatus for Removing Resist Particles from Stripping Solutions for Printed Wireboards
Patent:
5,599,444 →
Application:
08/413,760 →
Solution for Coating Non-Conductors with Conductive Polymers and Their Metallization Process
Patent:
5,597,471 →
Application:
08/387,917 →
Process for Treating Plastic Surfaces and Swelling Solution
Patent:
5,591,488 →
Application:
08/411,752 →
Process for Improving the Coating of Electrolytically Treated Work Pieces, and Arrangement for Carrying Out the Process
Patent:
5,558,757 →
Application:
08/256,231 →
Treatment Method and Apparatus for Printed Circuit Boards and the Like
Patent:
5,553,700 →
Application:
08/419,717 →
Apparatus for Treatment of Printed Circuit Boards and the Like
Patent:
5,553,633 →
Application:
08/551,067 →
Self-Accelerating and Replenishing Non-Formaldehyde Immersion Coating Method
Patent:
5,543,182 →
Application:
08/389,565 →
Method and Apparatus for Removing Resist Particles from Stripping Solutions for Printed Wireboards
Patent:
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Application:
08/207,991 →
Complex Oligomeric or Polymeric Compounds for the Generation of Metal Seeds on a Substrate
Patent:
5,503,877 →
Application:
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Skirt for an Air Cushion Vehicle and Filament Member Thereto
Patent:
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Application:
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Treatment Method for Cleaning and Drying Printed Circuit Boards and the Like
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Application:
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Protection of Lead-Containing Anodes During Chromium Electroplating
Patent:
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Application:
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Acid Bath for the Galvanic Deposition of Copper, and the Use of Such a Bath
Patent:
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Application:
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Process for the Metallization of Nonconductive Substrates with Elimination of Electroless Metallization
Patent:
5,421,989 →
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Device for Masking Field Lines in an Electroplating Plant
Patent:
5,401,370 →
Application:
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Device for Screening Off Lines of Electric Flux in an Installation for Electrolytically Processing Essentially Flat Elements (Iii)
Patent:
5,391,276 →
Application:
08/108,690 →
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 17, 2012
From: SKUPIN, ANDREAS; BRUCKNER, HELMUT; LOWINSKI, CHRISTIAN
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 028567/0753 →
Assignment of Assignor's Interest
Aug 3, 2012
From: JENS HEYDECKE
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 028719/0271 →
Assignment of Assignor's Interest
Nov 21, 2012
From: HOFMANN, UDO; KRENZEL, VOLKER
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 029334/0545 →
Assignment of Assignor's Interest
Aug 19, 2013
From: BEDRNIK, LUKAS; HAAS, FRANTISEK; LANG, NADINE; VOGEL, ROLAND
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 031035/0225 →
Assignment of Assignor's Interest
Oct 22, 2013
From: SCHULZ, KLAUS-DIETER; WACHTER, PHILIPP; HARTMANN, PHILIP
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 031450/0646 →
Assignment of Assignor's Interest
Nov 11, 2013
From: BRÜNING, FRANK; BECK, BIRGIT; DOSSE, BEXY; ETZKORN, JOHANNES
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 031575/0297 →
Assignment of Assignor's Interest
Dec 5, 2013
From: HUELSMANN, THOMAS; CLICQUE, ARNO; TEWS, DIRK; KLOPPISCH, MIRKO
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 031719/0537 →
Assignment of Assignor's Interest
Dec 5, 2013
From: HEYDECKE, JENS; KUHNE, SEBASTIAN
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 031723/0084 →
Assignment of Assignor's Interest
Apr 5, 2014
From: DAMBROWSKY, NINA; HAUF, UWE; EWERT, INGO; ERBEN, CHRISTOF
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 032611/0695 →
Assignment of Assignor's Interest
Apr 30, 2014
From: JOSHI, NAYAN H.; CARVER, KERRI LITTLE; PATENA, THOMAS ANTHONY; RINGHOLZ, CHRISTOPHER GEORGE
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 032786/0270 →
Assignment of Assignor's Interest
Aug 27, 2014
From: MIRKOVIC, MARKO; KLOBUS, MARCIN; TONG, TERRY; CHEN, TED
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 033616/0463 →
Assignment of Assignor's Interest
Mar 8, 2016
From: STEINHAUSER, EDITH; ROSELER, SANDRA; WIESE, STEFANIE; NGUYEN, TANG CAM LAI
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 037922/0528 →
Assignment of Assignor's Interest
Mar 11, 2016
From: WEI, JEN-CHIEH; LIU, ZHIMING; SHI, STEVEN Z.; KUHR, WERNER G.
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 037961/0221 →
Assignment of Assignor's Interest
May 3, 2016
From: MACIOSSEK, ANDREAS; MANN, OLIVIER; CEBULLA, PAMELA
To: ATOTECH DEUTSCHLAND GMBH
Reel/Frame 038441/0706 →
Release of Security Interest
Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →
Security Interest
Mar 18, 2021
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
To: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
Reel/Frame 055650/0093 →
Release of Security Interest
Aug 18, 2022
From: GOLDMAN SACHS BANK USA, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH); ATOTECH USA, LLC
Reel/Frame 061521/0103 →