Methods of treating a surface to promote metal plating and devices formed
View Patent ↗Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.
1. A printed circuit board, comprising:
at least one substrate;
a layer of organic molecules attached to the at least one substrate wherein the layer of organic molecules is comprised of: a metal-binding molecule selected from the group of a porphyrin, a porphyrinic macrocycle, an expanded porphyrin, a contracted porphyrin, a linear porphyrin polymer, a porphyrinic sandwich coordination complex, or a porphyrin array, and said organic molecules further bearing one or more binding groups configured to bind metals and one or more attachment groups configured to attach to the organic molecule to the substrate; and
a metal layer atop said layer of organic molecules.
2. The printed circuit board of claim 1 wherein the at least one substrate is comprised of any one of more of: polymer, ceramic, carbon, epoxy, glass reinforced epoxy, phenol, polyimide resines, glass reinforced polyimide, cyanate; esters, polytetrafluoroethylene, Group III-IV elements, or mixtures thereof.
3. The printed circuit board of claim 1 further comprising at least two substrates forming a multi-layer printed circuit board.
4. The printed circuit board of claim 1 wherein said substrate comprises one or more vias formed therethrough, said vias having a layer of organic molecules formed thereon and a metal layer atop said layer of organic molecules.
5. The printed circuit board of claim 1 wherein said layer of organic molecules forms a sublayer which is functionalized with one or more elements.
6. The printed circuit board of claim 5 wherein the sublayer is functionalized by electro-deposition or electro-attaching of any one or more of: vinyl monomers, strained rings, diazonium salts, alkynes, Grignard derivatives, and combinations thereof.