Plating bath for electroless deposition of nickel layers

1. An aqueous plating bath composition for electroless deposition of nickel and nickel alloys, the plating bath comprising

(i) a source of nickel ions,

(ii) at least one complexing agent,

(iii) at least one reducing agent, and

(iv) a stabilising agent according to formula (1):

wherein X is selected from the group consisting of O and NR 4 , n ranges from 1 to 6, m ranges from 1 to 8; R 1 , R 2 , R 3 and R 4 are independently selected from the group consisting of hydrogen and C 1 to C 4 alkyl; Y is selected from the group consisting of —SO 3 R 5 , —CO 2 R 5 and —PO 3 R 5 2 , and R 5 is selected from the group consisting of hydrogen, C1-C4 alkyl and a suitable counter ion wherein the concentration of the stabilizing agent according to formula (1) ranges from 0.02 to 5.0 mmol/l.

2. The aqueous electroless plating bath according to claim 1 wherein R′, R 2 , R 3 and R 4 are selected from the group consisting of hydrogen, methyl and ethyl.

3. The aqueous electroless plating bath according to claim 1 wherein R 5 is selected from the group consisting of hydrogen, methyl, ethyl, sodium, potassium, nickel and ammonium.

4. The aqueous electroless plating bath according to claim 1 wherein Y is SO 3 R 5 .

5. The aqueous electroless plating bath according to claim 1 further comprising at least one source of the alloying metal ion and wherein the at least one alloying metal ion is selected from the group consisting of titanium, vanadium, chromium, manganese, zirconium, niobium, molybdenum, hafnium, tantalum, tungsten, copper, silver, gold, aluminium, iron, cobalt, palladium, ruthenium, rhodium, osmium, iridium, platinum, zinc, cadmium, gallium, indium, tin, antimony, thallium, lead, and bismuth.

6. The aqueous electroless plating bath according to claim 1 wherein the plating bath has a pH value of 3.5 to 7.

7. The aqueous electroless plating bath according to claim 1 wherein the concentration of nickel ions ranges from 0.1 to 60 g/l.

8. The aqueous electroless plating bath according to claim 1 wherein the at least one complexing agent is selected from the group consisting of amines, carboxylic acids, hydroxyl carboxylic acids, aminocarboxylic acids and salts of the aforementioned.

9. The aqueous electroless plating bath according to claim 1 wherein the concentration of the at least one complexing agent ranges from 0.01 to 3.0 mol/l.

10. The aqueous electroless plating bath according to claim 1 wherein the concentration of the at least one reducing agent ranges from 0.01 to 3.0 mol/I.

11. The aqueous electroless plating bath according to claim 1 wherein the at least one reducing agent is a hypophosphite salt.

12. A method for electroless deposition of nickel and nickel alloys comprising the steps of

(i) providing a substrate,

(ii) immersing the substrate in the aqueous electroless plating bath according to claim 1 ,

(iii) and thereby depositing a nickel or nickel alloy onto the substrate.

13. Method according to claim 12 wherein the electroless plating bath contains hypophosphite as the at least one reducing agent.

14. Method according to claim 12 wherein the plating rate varies between 4-14 μm/hour to obtain a phosphorous content of between 10 to 15 wt. %.

15. Method according to claim 13 wherein the plating rate varies between 4-14 μm/hour to obtain a phosphorous content of between 10 to 15 wt. %.

16. The aqueous electroless plating bath according to claim 2 wherein R 5 is selected from the group consisting of hydrogen, methyl, ethyl, sodium, potassium, nickel and ammonium.

17. The aqueous electroless plating bath according to claim 2 wherein Y is SO 3 R 5 .

18. The aqueous electroless plating bath according to claim 3 wherein Y is SO 3 R 5 .

19. The aqueous electroless plating bath according to claim 1 wherein R 1 , R 2 , R 3 and R 4 are selected from the group consisting of hydrogen, methyl and ethyl, R 5 is selected from the group consisting of hydrogen, methyl, ethyl, sodium, potassium, nickel and ammonium, and Y is SO 3 R 5 .