Aqueous, acid bath and method for the electrolytic deposition of copper
View Patent ↗An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.
1. An aqueous, acid bath for the electrolytic deposition of copper, said bath containing at least one copper ion source, at least one acid ion source, at least one brightener compound and at least one leveler compound, wherein said at least one leveler compound is a synthetically produced functionalized peptide, wherein said functionalized peptide is a peptide functionalized with at least one moiety selected from the group consisting of polyalkylene glycol groups, polyalkylene imine groups and polyvinyl alcohol groups, and wherein said functionalized peptide contains, at the C terminus thereof, an end amino acid, which is selected from the group consisting of leucine, isoleucine, methionine, phenylalanine, tryptophan, asparagine, glutamine, thyronine, lysine, arginine and histidine.
2. The aqueous, acid bath for the electrolytic deposition of copper according to claim 1 , wherein the at least one leveler compound does not comprise diglycine, triglycine, polyglycine and carnosine (beta-alanyl-L-histidine).
3. The aqueous, acid bath for the electrolytic deposition of copper according to claim 1 , wherein at least one of the polyalkylene glycol groups and the polyalkylene imine groups have the general chemical formula —(X—CHR—CH 2 ) n —R′, wherein X is O or NH, R is H or methyl, each X and each R in a (X—CHR—CH 2 ) moiety can be selected independently of each X and R in another (X—CHR—CH 2 ) moiety, wherein further n is an integer of from about 2 to about 1000 and R′ is H, alkyl or aryl.
4. The aqueous, acid bath for the electrolytic deposition of copper according to claim 3 , wherein —(X—CHR—CH 2 ) n —R′ is selected from the group consisting of homo-polyethylene glycol radicals, homo polypropylene glycol radicals, homo polyethylene imine radicals and copolymer radicals comprising at least two units, selected from the group consisting of ethylene glycol units, propylene glycol units and ethylene imine units.
5. The aqueous, acid bath for the electrolytic deposition of copper according to claim 4 , wherein the copolymer radicals are formed from block copolymers, comprising said ethylene glycol units and said propylene glycol units.
6. The aqueous, acid bath for the electrolytic deposition of copper according to claim 3 , wherein —(X—CHR—CH 2 ) n —R′ has a mean molecular weight of from about 300 to about 35,000 Dalton.
7. The aqueous, acid bath for the electrolytic deposition of copper according to claim 3 , wherein n is from about 20 to about 500.
8. The aqueous, acid bath for the electrolytic deposition of copper according to claim 3 , wherein R′ is selected from the group consisting of H, C 1 -C 8 -alkyl and C 5 -C 12 -aryl.
9. The aqueous, acid bath for the electrolytic deposition of copper according to claim 1 , wherein said peptide is selected from oligopeptides, containing from about 2 to about 10 amino acid units.
10. The aqueous, acid bath for the electrolytic deposition of copper according to claim 1 , wherein said functionalized peptide contains at least one beta-amino acid, which is selected from the group consisting of beta-alanine, beta-phenyl alanine, beta-tryptophan, beta-thyrosine, beta-leucine, beta-isoleucine, beta-glutamine, beta-glutamine acid, beta-histidine, beta-methionine and asparagine acid.
11. The aqueous, acid bath for the electrolytic deposition of copper according to claim 1 , wherein said at least one brightener compound is selected from the group consisting of organic thiol compounds, organic sulfide compounds, organic disulfide compounds and organic polysulfide compounds.
12. The aqueous, acid bath for the electrolytic deposition of copper according to claim 1 , wherein said at least one leveler compound is present in a concentration of 0.01 mg/l to 1000 mg/l and wherein said at least one copper ion source is present in a concentration of 20 g/l to 250 g/l.
13. The aqueous, acid bath for the electrolytic deposition of copper according to claim 12 , wherein said at least one copper ion source includes one or more copper salts.
14. The aqueous, acid bath for the electrolytic deposition of copper according to claim 13 , wherein said one or more copper salts include copper sulfate.
15. The aqueous, acid bath for the electrolytic deposition of copper according to claim 12 , wherein said at least one copper ion source consists of copper sulfate.
16. A method for the electrolytic deposition of copper on a work piece, said method comprising: (i) providing said aqueous, acid bath for the electrolytic deposition of copper in accordance with claim 1 and at least one anode, (ii) bringing said work piece and at least one anode into contact with said aqueous, acid bath and (iii) generating an electric current flow between said work piece and said at least one anode so that the copper is deposited on the work piece.
17. The method for the electrolytic deposition of copper in accordance with claim 16 , wherein said work piece is a printed circuit board, a chip carrier or a semiconductor wafer.
18. The method for the electrolytic deposition of copper in accordance with claim 17 , wherein the copper is deposited in trenches and blind micro vias of the printed circuit board, the chip carrier or the semiconductor wafer.