Metal plating additive, and method for plating substrates and products therefrom
View Patent ↗The present invention is directed to the fabrication of rigid memory disks, including a metal plating composition which impedes deposition of non-metallic particles during a plating process. The plating composition includes at least one sulfated fatty acid ester additive, or mixtures or salts thereof, of formula: wherein R1 is selected from the group consisting of OH, OCH 2 , H 2 CH 3 , C1-C7 alkyl, linear or branched; R2 selected from H and C1-C7 alkyl, linear or branched; m=1 to about 5; n=2 to about 30; o=0 to about 10; M+ is a metal or pseudo metal ion or H+. The additive has a zeta potential which impedes deposit of non-metallic particles. The invention is further directed to a method for electroless plating utilizing the additive composition in a bath with at least a stabilizing agent, complexing agent and reducing agent and source of metal ions.
1. A method for depositing an electroless metal or metal alloy on a substrate for substantially avoiding co-deposition of non-metallic particles comprising, plating the substrate with metal or metal alloy while rendering an anionic character to either or both of the non-metallic particles and the plating surface of the substrate in an autocatalytic plating bath, the plating bath having at least one reaction product additive from a mixture produced from the sulfation and esterification of a fatty acid or mixtures and salts thereof,
wherein the at least one reaction product additive is represented by the formula
wherein R 1 is selected from the group consisting of OH, OCH 3 , OCH 2 CH 3 , C 1 -C 7 alkyl, linear or branched;
R 2 is selected from the group consisting of H and C 1 -C 7 alkyl, linear or branched;
m is an integer ranging from 1 to about 5;
n is an integer ranging from 2 to about 30;
o is an integer ranging from 0 to about 10;
M+ is a metal or pseudo metal ion or H + , and
the plating bath having a zeta potential between −40 and −150 mV.
2. The method according to claim 1 , wherein the substrate is iron, nickel or aluminum or an alloy of such metal or metals.
3. The method according to claim 1 , wherein the metal is nickel and a plated nickel or nickel alloy layer has a thickness of about 1 to about 75 μm.
4. The method according to claim 3 , wherein the thickness is between about 8 and about 15 μm.
5. The method according to claim 1 , wherein the temperature of the plating bath is between about 40 and about 95° C.
6. The method according to claim 1 , wherein the plating bath further includes stabilizing agent, complexing or reducing agent, or mixtures thereof.
7. The method according to claim 1 , wherein the non-metallic particles are plastic.
8. The method according to claim 7 , wherein the plastic is polysulfone.
9. The method according to claim 7 , wherein the plastic is polyvinylidene fluoride.
10. The method according to claim 7 , wherein the plastic is polytetrafluoroethylene.
11. The method according to claim 1 , where the plated substrate is a precursor for a rigid memory disk.
12. The method according to claim 1 wherein the autocatalytic plating bath contains a sufficient quantity of the at least one reaction product additive that the plated metal or metal alloy coated substrate is substantially free of non-metallic particles co-deposited on the substrate.
13. A method for fabricating a rigid memory disk comprising,
depositing in an autocatalytic plating bath an electroless nickel or nickel alloy coating on a substrate substantially avoiding co-deposition of non-metallic particles,
plating the substrate with nickel or nickel alloy wherein a zeta potential of the autocatalytic plating bath renders the ionic character of both the non-metallic particles and the surface of the plated substrate anionic such that the particles and the surface repel one another in the autocatalytic plating bath, the autocatalytic plating bath having at least one reaction product additive from a mixture produced from the sulfation and esterification of a fatty acid or mixtures and salts thereof,
wherein the at least one reaction product additive is represented by the formula
wherein R 1 is selected from the group consisting of OH, OCH 3 , OCH 2 CH 3 , C 1 -C 7 alkyl, linear or branched;
R 2 is selected from the group consisting of H and C 1 -C 7 alkyl, linear or branched;
m is an integer ranging from 1 to about 5;
n is an integer ranging from 2 to about 30;
o is an integer ranging from 0 to about 10;
M+ is a metal or pseudo metal ion or H+, and
the zeta potential is between −40 and −150 mV.
14. The method according to claim 13 wherein the autocatalytic plating bath contains a sufficient quantity of the at least one reaction product additive that the plated metal or metal alloy coated substrate is substantially free of non-metallic particles co-deposited.