COMPOSITION FOR FORMING A SEED LAYER
A composition for forming a seed layer, the composition comprising: (a.) a first metal fine particle; and (b.) a metallic component selected from a metal oxide fine particle, an organic metal complex, a second metal fine particle, and combinations thereof, wherein the second metal fine particle has a greater affinity for oxygen than the first fine particle. A seed layer as defined, and a coating including a seed layer and the use of this coating. Further, the invention relates to a method of forming a seed layer comprising applying a composition comprising a first metal fine particle, and a metallic component selected from a metal oxide fine particle, an organic metal complex, a second fine metal particle, and combinations thereof, wherein the second metal fine particle has a greater affinity for oxygen than the first metal fine particle to a surface of a substrate, and setting the composition.
1 . A composition for forming a seed layer, the composition comprising:
a. a first metal fine particle; and
b. a metallic component selected from a metal oxide fine particle, an organic metal complex, a second metal fine particle, and combinations thereof,
wherein the second metal fine particle has a greater affinity for oxygen than the first fine particle.
2 . A composition according to claim 1 , wherein the composition comprises a first metal fine particle, a metal oxide fine particle, and/or an organic metal complex.
3 . A composition according to claim 1 , wherein the composition comprises a first metal fine particle and a second metal fine particle.
4 . A composition according to claim 1 wherein the fine particles are nanoparticles.
5 . A composition according to claim 1 , wherein the first metal fine particle is selected from copper fine particles, zinc fine particles, nickel fine particles, and combinations thereof.
6 . A composition according to claim 5 , wherein the first metal fine particle comprises copper fine particles.
7 . A composition according to claim 1 , wherein the metal oxide fine particles are selected from oxides of titanium, zinc, tungsten, zirconium, nickel, copper, silver, cerium, silicon, aluminium, and combinations thereof.
8 . A composition according to claim 7 , wherein the metal oxide fine particles comprise titanium.
9 . A composition according to any preceding claim claim 1 , wherein the second metal fine particle is selected from chromium, vanadium, molybdenum, nickel, and combinations thereof.
10 . A composition according to claim 9 , wherein the second metal fine particle comprises nickel.
11 . A composition according to claim 1 , wherein the first metal fine particles, the second metal fine particles, and/or the metal oxide fine particles have a mean particle size diameter in the range 5-50 nm.
12 . A composition according to claim 1 , wherein the metal fine particles and/or the metal oxide fine particles are coated.
13 . A composition according to claim 1 , wherein the metal fine particles and/or the metal oxide fine particles are composite particles.
14 . A composition according to claim 1 , wherein the organic metal complex comprises chelating ligands.
15 . A composition according to claim 14 , wherein the organic metal complex comprises titanium isopropoxide.
16 . A composition according to claim 1 , wherein the organic metal complex is dispersed in a mixture of lactate and acetylacetone or in alcoholic solution.
17 . A seed layer comprising a composition according to claim 1 .
18 . A seed layer according to claim 17 , of depth in the range 1-3 μm.
19 . A coating including a seed layer according to claim 17 and a surface layer.
20 . A coating according to claim 19 , wherein the surface layer comprises a metal selected from copper, zinc, nickel, and combinations thereof.
21 . A coating according to claim 20 , wherein the surface layer comprises copper.
22 . A coating according to claim 19 , wherein the surface layer is of depth in the range 0.5-2 μm.
23 . An article comprising a coating according to claim 19 .
24 . An article according to claim 23 comprising at least one polymeric or glass surface to which the coating is applied.
25 . A method of forming a seed layer comprising:
a. applying a composition comprising a first metal fine particle, and a metallic component selected from a metal oxide fine particle, an organic metal complex, a second fine metal particle, and combinations thereof, wherein the second metal fine particle has a greater affinity for oxygen than the first metal fine particle to a surface of a substrate; and
b. setting the composition.
26 . A method according to claim 25 , comprising the additional step of cleaning the substrate before application of the composition.
27 . A method according to claim 26 , wherein application of the composition comprises printing the composition onto the substrate.
28 . A method according to claim 25 , comprising the additional step of drying the composition prior to setting.
29 . A method according to claim 25 , wherein setting the composition comprises laser curing or laser patterning.
30 . A method according to claim 29 , comprising the additional step of removing unsintered composition where setting of the composition comprises laser patterning.
31 . A method according to claim 29 , wherein setting the composition comprises baking the composition after laser curing and/or after laser patterning and subsequent removal of unsintered composition.
32 . A method of coating an article comprising:
a) forming a seed layer using a method according to claim 25 ;
b) activating the seed layer;
c) applying a surface layer to the seed layer; and
d) setting the surface layer.
33 . A method according to claim 32 , wherein activating the seed layer comprises acidifying the seed layer.
34 . A method according to claim 32 , wherein applying a surface layer to the seed layer comprises electroless plating, electroplating, or a combination thereof.
35 . A method according to claim 34 , wherein electroless plating is performed directly on the seed layer formed in step a).
36 . A method according to claim 34 , wherein electroless plating is in a plating bath suitable for the deposition of a copper or nickel layer.
37 . A method according to claim 36 , wherein the thickness of the copper or nickel layer is in the range 0.1 to 20 μm.
38 . A method according to claim 32 , wherein setting of the surface layer comprises baking the coated article.
39 . A method of production of coated glass articles comprising applying the coating of claim 19 to an article.
40 . A method according to claim 39 wherein the article is a flat panel display element, a touch panel display element, an OLED, or a printed circuit board.
41 . (canceled)