Method of manufacturing pattern-forming metal structures on a carrier substrate
View Patent ↗To improve the transmission properties of antennae manufactured with known methods, more specifically antennae for application in the UHF range, a method is proposed of producing pattern-forming metal structures on a carrier substrate. The method comprises the following method steps: providing the carrier substrate, forming the pattern on the carrier substrate with a composite material containing dispersed metal, bringing the carrier substrate into contact with halide ions, and thereafter depositing a metal layer onto the pattern formed by the composite material, producing thereby metal structures.
1. A method of manufacturing a pattern-forming metal structure on a carrier substrate, comprising the following steps:
a. providing the carrier substrate;
b. forming a pattern on the carrier substrate with a composite material containing dispersed metal;
c. bringing the pattern on the carrier substrate into contact an acid and halide ions; and
d. following c), depositing a metal layer onto the pattern formed by the composite material by a charge exchange reaction, producing thereby the metal structure.
2. The method according to claim 1 , characterized in that the halide ions are chloride ions, bromide ions or iodide ions.
3. The method according to claim 1 , characterized in that the metal deposited in step d) is copper.
4. The method according to claim 3 , characterized in that the copper is deposited by means of an acidic solution.
5. The method according to claim 4 , characterized in that the acidic solution contains sulfuric acid.
6. The method according to claim 3 , characterized in that the copper is deposited by means of a solution containing at least one complexing agent for copper.
7. The method according to claim 3 , characterized in that the metal dispersed in the composite material is less noble than copper.
8. The method according to claim 1 , characterized in that the composite material contains at least one dispersed metal selected from iron, iron base alloys, zinc and zinc base alloys.
9. The method according to claim 1 , characterized in that the dispersed metal is iron.
10. The method according to claim 8 , characterized in that the iron is made from iron carbonyl.
11. The method according to claim 1 , characterized in that the dispersed metal has a particle size not exceeding 6 μm.
12. The method according to claim 1 , characterized in that the composite material additionally contains conductive carbon particles.
13. The method according to claim 1 , characterized in that the pattern-forming composite material is gelled at room temperature.
14. The method according to claim 1 , characterized in that the metal layer deposited onto the composite material is tempered at increased temperature.
15. The method according to claim 14 , characterized in that the tempering temperature is just low enough not to impair the carrier substrate.
16. The method according to claim 1 , characterized in that the metal layer is deposited onto the composite material with a thickness not exceeding 5 μm.
17. The method according to claim 1 , characterized in that the composite material contains at least one binder selected from epoxy resins, polyurethane resins and acrylic resins.
18. The method according to claim 1 , characterized in that the composite material is a conductive paste.
19. The method according to claim 1 , characterized in that the pattern is formed on the carrier substrate by printing.
20. The method according to claim 1 , characterized in that the pattern is formed on the carrier substrate by screen printing.
21. The method according to claim 1 , characterized in that the carrier substrate consists of at least one material selected from polyethylene terephthalate, polyvinyl chloride, polycarbonate, polyethylene naphthalate and impregnated paper.
22. The method according to claim 1 , characterized in that the pattern is an antenna structure.
23. The method according to claim 22 , characterized in that the antenna structure has connecting pads provided for contacting a semiconductor component.
24. The method according to claim 22 , characterized in that the antenna structure is suited for UHF reception.
25. The method according to claim 1 , characterized in that the metal structure is suited for manufacturing antennae for RFID use.
26. The method according to claim 9 , characterized in that the iron is made from iron carbonyl.
27. A method of manufacturing a pattern-forming metal structure on a carrier substrate, comprising the following steps:
a. providing the carrier substrate;
b. forming a pattern on the carrier substrate with a composite material containing dispersed metal;
c. bringing the pattern on the carrier substrate into contact with an acid and halide ions; and
d. immediately following step c), depositing a metal layer onto the pattern formed by the composite material by a charge exchange reaction, producing thereby the metal structure.
28. The method of claim 1 , characterized in that in step c), the acid and the halide ions are provided as hydrochloric acid.