Conveyorized plating line and method for electrolytically metal plating a workpiece
View Patent ↗To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.
1. A conveyorized plating line for electrolytically metal plating workpieces, wherein means ( 17 , 18 , 21 ) are provided to reduce an electric voltage that builds up between adjacent workpieces ( 5 , 6 , 7 ) being conveyed through the line, wherein the means are at least one guard electrode ( 17 , 18 ) that is provided for in the line, in an entrance region for the workpieces ( 5 , 6 , 7 ).
2. The conveyorized plating line according to claim 1 , wherein the at least one guard electrode ( 17 , 18 ) substantially delimits the entrance region from a processing region for the workpieces ( 5 , 6 , 7 ) in which anodes ( 11 ) are disposed.
3. The conveyorized plating line according to one of the claims 1 and 2 , wherein the at least one guard electrode ( 17 , 18 ) is disposed in such a manner that it does not touch the workpieces ( 5 , 6 , 7 ) as they are being passed through the line.
4. The conveyorized plating line according to one of the claims 1 - 2 , wherein the at least one guard electrode ( 17 , 18 ) is cathodically polarizable relative to the anodes ( 11 ).
5. The conveyorized plating line according to one of the claims 1 - 2 , wherein the at least one guard electrode ( 17 , 18 ) is connected to a current source for electrolytic metal plating through at least one limiting resistor ( 19 , 20 ).
6. The conveyorized plating line according to claim 5 , wherein the at least one limiting resistor ( 19 , 20 ) is adjustable.
7. The conveyorized plating line according to one of the claims 1 - 2 , wherein the number, the shape, the spatial arrangement and/or the size of the at least one guard electrode ( 17 , 18 ) are determined in view of the reduction of the electric voltage between adjacent workpieces ( 5 , 6 , 7 ) in the line.
8. The conveyorized plating line according to one of the claims 1 - 2 , wherein at least one current source providing an electric current flow to the workpieces ( 5 , 6 , 7 ) is provided, wherein electrical contacting members ( 9 , 16 ) for the workpieces ( 5 , 6 , 7 ) are provided and wherein at least one electric compensating resistor ( 21 ) is provided for in a current path leading from the current source to the contacting members ( 9 , 16 ).
9. The conveyorized plating line according to claim 8 , wherein the at least one current source is electrically connected to the electrical contacting members ( 9 , 16 ) for the workpieces ( 5 , 6 , 7 ) through current, lines and a contact rail or brushes, at least one electric compensating resistor being mounted in series in proximity to the entrance region of the line and the contacting members being connected to either end of the at least one compensating resistor.
10. The conveyorized plating line according to claim 8 , wherein the at least one compensating resistor ( 21 ) is adjustable.
11. The conveyorized plating line according to claim 8 , wherein, if at least two contacting members ( 9 , 16 ) are provided, the compensating resistor ( 21 ) are adjustable in such a manner that the voltage drop is greatest in that compensating resistor ( 21 ) which is assigned to the first contacting member ( 9 ) as viewed in the direction of transport.
12. The conveyorized plating line according to one of claims 1 - 2 , wherein, for contacting the workpieces ( 5 , 6 , 7 ) with the electrolyte fluid as they are being passed through the line a space in which the electrolyte fluid accumulates is provided which the workpieces ( 5 , 6 , 7 ) can enter and which the workpieces ( 5 , 6 , 7 ) can exit again once the have been conveyed through the line.