Electroless nickel plating bath
The present invention concerns an electroless nickel plating bath suitable for application in plating on plastic processes. The plating bath is free of hazardous substances such as lead ions and ammonia and allows deposition of nickel phosphorous alloys on plastic substrates at plating temperatures not higher than 55° C. Furthermore, the deposition of copper from an immersion type copper plating bath onto the nickel phosphorous coatings require no activation step which results in less process steps and less waste water production.
1. An ammonia- and lead-free electroless nickel plating bath for deposition of nickel phosphorus alloys having a phosphorus content of 6 to 9 wt.-% comprising
i. a source of nickel ions, at a concentration of 2.5 g/l to 4 g/l,
ii. a source of hypophosphite ions, at a concentration of 20 g/l to 27 g/l,
iii. a complexant mixture comprising
a) at least one first complexant at a concentration of from 1 g/l to 50 g/l selected from the group consisting of hydroxy carboxylic acids, dihydroxy carboxylic acids and salts thereof and
b) at least one second complexant at a concentration of from 0.2 g/l to 10 g/l selected from the group consisting of iminosuccinic acid, iminodisuccinic acid, salts and derivatives thereof,
iv. a stabilizer mixture comprising
a) bismuth ions, at a concentration of 0.5 mg/l to 30 mg/l and
b) at least one compound selected from the group consisting of mercapto benzoic acids, mercapto carboxylic acids and mercapto sulfonic acids and salts thereof, at a concentration of 0.1 mg/l to 100 mg/l,
wherein the bath has a pH in the range from 6.5 to 11.5.
2. An electroless nickel plating bath according to claim 1 wherein the at least one first complexant is selected from the group consisting of hydroxymalonic acid, glycolic acid, lactic acid, citric acid, mandelic acid, tartaric acid, malic acid, paratartaric acid, succinic acid, aspartic acid and salts thereof.
3. An electroless nickel plating bath according to claim 1 wherein the concentration of the at least one first complexant ranges from 10 g/l to 20 g/l.
4. An electroless nickel plating bath according to claim 1 wherein the concentration of the at least one second complexant ranges from 0.8 g/l to 5 g/l.
5. An electroless nickel plating bath according to claim 1 wherein the concentration of bismuth ions ranges from 1 mg/l to 30 mg/l.
6. An electroless nickel plating bath according to claim 1 wherein the mercapto benzoic acid derivative is selected from the group consisting of 2-mercapto benzoic acid, 3-mercapto benzoic acid, 4-mercapto benzoic acid, salts thereof and mixtures thereof.
7. An electroless nickel plating bath according to claim 1 wherein the mercapto carboxylic acid is selected from the group consisting of 3-mercaptopropionic acid, 3-mercapto-2-methylpropionic acid, 2-mercaptopropanoic acid, mercapto acetic acid, 4-mercaptobutyric acid and 3-mercaptoisobutyric acid.
8. An electroless nickel plating bath according to claim 1 wherein the mercapto sulfonic acid is selected from the group consisting of 2-mercapto-1-ethane sulfonic acid, 3-mercapto-1-propane sulfonic acid, and 4-mercapto-1-butane sulfonic acid.
9. An electroless nickel plating bath according to claim 1 wherein the concentration of the mercapto benzoic acids, mercapto carboxylic acids and mercapto sulfonic acids and salts thereof ranges from 0.5 mg/l to 30 mg/l.
10. A method for metal plating of non-conductive substrates, which comprises the following steps:
i. providing a conductive seed layer onto the non-conductive substrate;
ii. applying a nickel phosphorous coating to said non-conductive substrate by bringing it into contact with a plating bath composition according to claim 1 at a temperature in the range of 25 to 35° for a time ranging from 4 to 120 min;
iii. optionally, rinsing the such plated substrate with water; and
iv. applying a copper coating onto the nickel phosphorous coating by bringing the plastic substrate into contact with an immersion copper plating bath comprising copper ions,
wherein a nickel phosphorus alloy having a phosphorus content of 6 to 9 wt.-% is deposited on the substrate.
11. A method according to claim 10 , wherein the plating temperature ranges between 27-32°.
12. A method according to claim 10 , wherein the non-conductive substrate is a plastic substrate made of ABS or ABS/PC blend.
13. A method according to claim 10 , further comprising
v. applying at least one electrolytically deposited metal layer onto the immersion copper layer deposited in step iv., wherein the at least one electrolytically deposited layer is selected from copper, nickel, chromium or its alloys.
14. A method according to claim 11 , wherein the non-conductive substrate is a plastic substrate made of ABS or ABS/PC blend.
15. A method according to claim 11 , further comprising
v. applying at least one electrolytically deposited metal layer onto the immersion copper layer deposited in step iv., wherein the at least one electrolytically deposited layer is selected from copper, nickel, chromium or its alloys.
16. A method according to claim 12 , further comprising
v. applying at least one electrolytically deposited metal layer onto the immersion copper layer deposited in step iv., wherein the at least one electrolytically deposited layer is selected from copper, nickel, chromium or its alloys.