Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
View Patent ↗The present invention provides a non-cyanide aqueous acidic immersion plating solution having a pH of from about 3.5 to about 6.5 and comprising zinc ions, nickel ions and/or cobalt iron ions, and fluoride ions. In one embodiment the immersion plating solutions of the invention also contain at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms. The present invention also relates to methods for depositing zinc alloy protective coatings on aluminum and aluminum alloy substrates comprising immersing the aluminum or aluminum alloy substrate in the non-cyanide acidic immersion plating solutions of the invention. Optionally, the zinc alloy coated aluminum or aluminum alloy substrate is plated using an electroless or electrolytic metal plating solution.
1. A process for depositing a zinc alloy protective coating on aluminum or aluminum based alloy substrates which comprises
(A) immersion plating an aluminum or aluminum based alloy substrate by immersing the substrate in an aqueous acidic immersion plating solution having a pH of from about 4.5 to about 5.5 and comprising zinc ions, nickel and/or cobalt ions, fluoride ions and at least one inhibitor provided the solution is free of cyanide ions for a period of time sufficient to deposit the desired coating, and
(B) removing the coated substrate from the immersion plating solution,
wherein the at least one inhibitor is a mercapto substituted nitrogen-containing heterocyclic compound and the zinc ions and the nickel and/or cobalt ions are provided with acetate as counter ion.
2. The process of claim 1 wherein the surface of the aluminum or aluminum based alloy is cleaned, etched and desmutted prior to immersion in the immersion plating solution.
3. The process of claim 2 wherein the cleaning is performed with an alkaline, acidic, or solvent cleaner, and the etching is performed with an alkaline or acid etching solution.
4. The process of claim 2 wherein the aluminum or aluminum based alloy is rinsed with water after each of the cleaning, etching, desmutting, and immersion plating steps.
5. The process of claim 1 wherein the plating solution also contains one or more metal complexing agents.
6. The process of claim 5 wherein the metal complexing agent is selected from an acetate, citrate, glycollate, lactate, maleate, pyrophosphate, tartrate, gluconate, or glucoheptonate, and mixtures thereof.
7. The process of claim 1 wherein the plating solution also contains one or more additional metal ions selected from copper ions, iron ions, manganese ions, magnesium ions and zirconium ions.
8. The process of claim 1 wherein the mercapto substituted nitrogen-containing heterocyclic compound is selected from thiazoles, thiazolines, and thiazolidines.
9. The process of claim 1 wherein the plating solution contains
from about 1 to about 150 g/l of zinc ions, and
from about 5 to about 250 g/l of nickel and/or cobalt ions.
10. The process of claim 1 wherein the plating solution contains from about 0.0005 to about 5 g/l of the inhibitor.
11. The process of claim 1 wherein the plating solution is free of aliphatic amines and aliphatic hydroxylamines.
12. The process of claim 1 wherein the solution further comprises from about 0.5 to about 10 g/l of fluoride ions.
13. A process for depositing a zinc alloy protective coating on aluminum or aluminum based alloy substrate which comprises
(A) immersion plating the substrate by immersing the substrate in an aqueous acidic immersion plating solution having a pH of from about 4.5 to about 5.5 and comprising:
from about 10 to about 30 g/l of zinc ions,
from about 20 to about 50 g/l of nickel and/or cobalt ions,
from about 0.5 to about 10 g/l of fluoride ions, and
from about 0.005 to about 0.05 g/l of at least one inhibitor for a period of time sufficient to deposit the desired coating, and
(B) removing the coated substrate from the immersion plating solution
wherein the at least one inhibitor is a mercapto substituted nitrogen-containing heterocyclic compound and the zinc ions and the nickel and/or cobalt ions are provided with acetate as counter ion.
14. The process of claim 13 wherein the surface of the substrate is cleaned, etched and desmutted prior to immersion in the immersion plating solution.
15. The process of claim 14 wherein the cleaning is performed with an alkaline, acidic, or solvent cleaner, and the etching is performed with alkaline or acid etching solution.
16. The process of claim 14 wherein the substrate is rinsed with water after each of the cleaning, etching, desmutting, and immersion plating steps.
17. The process of claim 13 wherein the plating solution also contains from about 1 to about 250 g/l of at least one metal complexing agent.
18. The process of claim 17 wherein the metal complexing agent is selected from an acetate, citrate, glycollate, lactate, maleate, pyrophosphate, tartrate, gluconate, or glucoheptonate, and mixtures thereof.
19. The process of claim 13 wherein the mercapto substituted nitrogen-containing heterocyclic compound is selected from thiazoles, thiazolines, and thiazolidines.
20. The process of claim 13 wherein the plating solution is free of aliphatic amines and aliphatic hydroxylamines.
21. The process of claim 13 wherein the plating solution further comprises one or more metal ions selected from copper ions, iron ions, manganese Ions, magnesium ions and zirconium ions.
22. A process for depositing a metal coating on an aluminum or aluminum alloy substrate comprising
(A) applying an immersion zinc alloy protective coating on the substrate by immersion plating the substrate in an aqueous acidic immersion plating solution having a pH of from about 4.5 to about 5.5 and comprising zinc ions, nickel and/or cobalt ions, fluoride ions and at least one inhibitor provided the solution is free of cyanide ions for a period of time sufficient to deposit the desired coating, and
(B) plating the zinc alloy coated substrate using an electroless or electrolytic metal plating solution,
wherein the at least one inhibitor is a mercapto substituted nitrogen-containing heterocyclic compound and the zinc ions and the nickel and/or cobalt ions are provided with acetate as counter ion.
23. The process of claim 22 wherein the surface of the substrate is subjected to cleaning, acid etching and desmutting, prior to immersion in the immersion plating solution.
24. The process of claim 23 wherein the cleaning is performed with an alkaline, acidic, or solvent cleaner, and the etching is performed with alkaline or acid etching solution.
25. The process of claim 23 wherein the aluminum or aluminum based alloy is rinsed with water after each of the cleaning, etching, desmutting, and immersion plating steps.
26. The process of claim 22 wherein the plating solution contains
from about 1 to about 150 g/l of zinc ions, and
from about 5 to about 250 g/l of nickel and/or cobalt ions.
27. The process of claim 22 wherein the plating solution contains from about 0.0005 to about 5 g/l of the inhibitor.
28. The process of claim 22 wherein the plating solution also contains from about 1 to about 250 g/l of at least one metal complexing agent.
29. The process of claim 28 wherein the metal complexing agent is selected from an acetate, citrate, glycollate, lactate, maleate, pyrophosphate, tartrate, gluconate, or glucoheptonate, and mixtures thereof.
30. The process of claim 22 wherein the mercapto substituted nitrogen-containing heterocyclic compound is selected from thiazoles, thiazolines, and thiazolidines.
31. The process of claim 22 wherein the plating solution is free of aliphatic amines and aliphatic hydroxylamines.
32. The process of claim 22 wherein the plating solution further comprises one or more metal ions selected from copper ions, iron ions, manganese Ions, magnesium ions and zirconium ions.
33. The process of claim 22 wherein the solution further comprises from about 0.5 to about 10 g/l of fluoride ions.
34. A process for depositing a zinc alloy protective coating on aluminum or aluminum based alloy substrate which comprises
(A) immersion plating the substrate by immersing the substrate in an aqueous acidic immersion plating solution having a pH of from about 4.5 to about 5.5 and comprising:
from about 1 to about 150 g/l of zinc ions,
from about 5 to about 250 g/l of nickel and/or cobalt ions,
from about 0.005 to about 100 g/l of fluoride ions provided the solution is free of cyanide ions, and
from about 0.005 to about 100 g/l of at least one inhibitor for a period of time sufficient to deposit the desired coating, and
(B) removing the coated substrate from the immersion plating solution,
wherein the at least one inhibitor is a mercapto substituted nitrogen-containing heterocyclic compound and the zinc ions and the nickel and/or cobalt ions are provided with acetate as counter ion.
35. The process of claim 34 wherein the plating solution also contains at least one metal complexing agent.
36. The process of claim 35 wherein the metal complexing agent is selected from an acetate, citrate, glycollate, lactate, maleate, pyrophosphate, tartrate, gluconate, or glucoheptonate, and mixtures thereof.
37. The process of claim 34 wherein the mercapto substituted nitrogen-containing heterocyclic compound is selected from thiazoles. thiazolines, and thiazolidines.
38. The process of claim 34 wherein the plating solution also contains one or more metal ions selected from copper ions, iron ions, manganese Ions, magnesium ions and zirconium ions.
39. The process of claim 34 wherein the plating solution is free of aliphatic amines and aliphatic hydroxylamines.
40. The process of claim 34 wherein the surface of the aluminum or aluminum based alloy is cleaned, etched and desmutted prior to immersion in the immersion plating solution.
41. The process of claim 40 wherein the cleaning is performed with an alkaline, acidic, or solvent cleaner, and the etching is performed with an alkaline or acid etching solution.
42. The process of claim 40 wherein the aluminum or aluminum based alloy is rinsed with water after each of the cleaning, etching, desmutting, and immersion plating steps.