Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

1. Galvanic process for filling through-holes of a workpiece with metals comprising the following steps:

(i) bringing in contact the workpiece containing through-holes with a metal-deposition electrolyte and applying a voltage between the workpiece and at least one anode so that a current flow is supplied to the workpiece, wherein the current flow is chosen such that a deposition occurs in the center of the through-holes and, consequently, the through-holes completely or almost completely grow together;

(ii) further bringing in contact the workpiece with a metal-deposition electrolyte and applying a voltage between the workpiece and at least one anode so that a current flow is supplied to the workpiece, wherein the through-holes obtained in step (i), which are divided into to halves are filled by the metal,

wherein the current flow in accordance with step (i) is a pulse reverse current and in every cycle of the current at least one forward current pulse and at least one reverse current pulse occurs and that the current flow in accordance with step (ii) is either a pulse reverse current, a direct current or an alternating current, and wherein the ratio of the duration of the at least one forward current pulse to the duration of the at least one reverse current pulse is adjusted to 5-75.

2. Process according to claim 1 , characterized in that the metallization steps (i) and (ii) are carried out in different electrolytes.

3. Process according to claim 1 , characterized in that metallization steps (i) and (ii) are carried out in the same electrolyte.

4. Process according to claim 1 , characterized in that the duration of the at least one forward current pulse is adjusted to 5-250 ms.

5. Process according to claim 1 , characterized in that the duration of the at least one reverse current pulse is adjusted to 20 ms at most.

6. Process according to claim 1 , characterized in that the peak current density of the at least one forward current pulse at the workpiece is adjusted to 15 A/dm 2 at most.

7. Process according to claim 1 , characterized in that the peak current density of the at least one reverse current pulse at the workpiece is adjusted to 60 A/dm 2 at most.

8. Process according to claim 1 , characterized in that a first voltage is applied between a first side of the workpiece and at least a first anode so that a first pulse reverse current is supplied to the first side of the workpiece, wherein in every cycle of this first pulse reverse current at least a first forward current pulse and at least a first reverse current pulse flow, and

a second voltage is applied between a second side of the workpiece and at least a second anode so that a second pulse reverse current is supplied to the second side of the workpiece, wherein in every cycle of this second pulse reverse current at least a second forward current pulse and at least a second reverse current pulse flow.

9. Process according to claim 8 , characterized in that the first current pulses are offset relative to the second current pulses by about 180°.

10. Process according to claim 1 , characterized in that an acid copper electrolyte is used as electrolyte.

11. Process according to claim 1 , characterized in that the electrolyte comprises an inorganic matrix comprising 15-75 g/l copper, 20-400 g/l sulphuric acid and 20-200 mg/l chloride.

12. Process according to claim 1 , characterized in that the electrolyte further comprises organic additives selected from brightening agents, leveling agents and wetting agents.

13. Process according to claim 1 , characterized in that the electrolyte is operated with inert anodes with a redox system.

14. Process according to claim 1 , characterized in that as electrolyte an acid copper electrolyte and as anodes soluble anodes are used.

15. Process according to claim 1 , characterized in that the through-holes have a maximum height of 0.05-0.5 mm.

16. Process according to claim 1 , characterized in that the through-holes have a diameter of 60 μm-150 μm.

17. Process according to claim 1 , characterized in that the workpiece is board-shaped and has through-holes.

18. Process according to claim 1 , characterized in that the workpiece is a printed circuit board or any other board-shaped electric circuit carrier.

19. Galvanic process for filling through-holes of a workpiece with metals comprising the following steps:

(i) bringing in contact the workpiece containing through-holes with a metal-deposition electrolyte and applying a voltage between the workpiece and at least one anode so that a current flow is supplied to the workpiece, wherein the current flow is chosen such that a deposition occurs in the center of the through-holes and, consequently, the through-holes grow together;

(ii) further bringing in contact the workpiece with a metal-deposition electrolyte and applying a voltage between the workpiece and at least one anode so that a current flow is supplied to the workpiece, wherein the through-holes obtained in step (i) which are divided into two halves are filled by the metal,

wherein the current flow in accordance with step (i) is a pulse reverse current and in every cycle of the current at least one forward current pulse and at least one reverse current pulse occurs and that the current flow in accordance with step (ii) is either a pulse reverse current, a direct current or an alternating current, and wherein the ratio of the duration of the at least one forward current pulse to the duration of the at least one reverse current pulse is adjusted to 5-75,

wherein the electrolyte comprises an inorganic matrix comprising 15-75 g/1 copper, 20-400 g/1 sulphuric acid, and 20-200 mg/1 chloride,

wherein the electrolyte comprises organic additives such as brightening agents, leveling agents and wetting agents, and

wherein the electrolyte is operated with inert anodes with a redox system.

20. Galvanic process for filling through-holes of a workpieces with metals comprising the following steps:

(i) bringing in contact the workpiece containing through-holes with a metal-deposition electrolyte and applying a voltage between the workpiece and at least one anode so that a current flow is supplied to the workpiece, wherein the current flow is chosen such that a deposition occurs in the center of the through-holes and, consequently, the through-holes grow together;

(ii) further bringing in contact the workpiece with a metal-deposition electrolyte and applying a voltage between the workpiece and at least one anode so that a current flow is supplied to the workpiece, wherein the through-holes obtained in step (i) which are divided into two halves are filled by the metal,

wherein the current flow in accordance with step (i) is a pulse reverse current and in every cycle of the current at least one forward current pulse and at least one reverse current pulse occurs and that the current flow in accordance with step (ii) is either a pulse reverse current, a direct current or an alternating current, and wherein the ratio of the duration of the at least one forward current pulse to the duration of the at least one reverse current pulse is adjusted to 5-75,

wherein the through-holes have a diameter of 60 μm-150 μm. and a maximum height of 0.05-0.5 mm, and

wherein the workpiece is a printed circuit board or any other board-shaped electric circuit carrier.