Acidic treatment liquid and method of treating copper surfaces
View Patent ↗The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae: wherein R 1 and R 2 =alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R 3 =R 1 , R 1 —O, R 1 —S, amino or substituted amino, wherein R 1 and R 2 may especially be phenyl or substituted phenyl.
1. Acid treatment liquid for the treatment of copper surfaces comprising:
a. hydrogen peroxide and
b. at least one five-membered heterocyclic compound
wherein
c. additionally at least one microstructure modifying agent is contained, selected from the group consisting of organic thiols, organic disulfides and organic sulfides, wherein the organic sulfides have the general formula
wherein
R 1 and R 2 =alkyl, alkenyl, aryl, aralkyl, cycloalkyl and the derivatives thereof.
2. Treatment liquid according claim 1 , wherein the organic thiols have the general formula
the organic disulfides have the general formula
wherein
R 1 and R 2 =alkyl, alkenyl, aryl, aralkyl, cycloalkyl and the derivatives thereof.
3. Treatment liquid according to any one of the preceding claims 1 – 2 , wherein R 1 and R 2 contain a group mediating the solubility of the microstructure modifying agent in an aqueous solution.
4. Treatment liquid according to claim 3 , wherein the functional group mediating the solubility of the microstructure modifying agent in an aqueous solution is selected from the group consisting of amino, carboxy and sulfo.
5. Treatment liquid according to any one of the preceding claims 1 – 2 , wherein the at least one five-membered heterocyclic compound is selected from the group consisting of tetrazole and the derivatives thereof.
6. Treatment liquid according to claim 5 , wherein the at least one five-membered heterocyclic compound is selected from the group consisting of 5-aminotetrazole and 5-phenyltetrazole.
7. Treatment liquid according to any one of the preceding claims 1 – 2 , wherein the at least one microstructure modifying agent is selected from the group consisting of L-cysteine, DL-cysteine, 2-aminoethanethiol, mercaptoacetic acid, 3-mercapto-propionic acid, 2-mercaptoethanesulfonic acid, 3-mercaptopropanesulfonic acid, L-cystine, DL-cystine, D-cystine, bis-(2-aminoethyl) disulfide, dithiodiacetic acid, 3,3′-dithiodipropionic acid, 4,4′-dithiodibutyric acid, 3,3′-dithio-bis-(propanesulfonic acid), thiodiacetic acid, 3,3′-thiodipropionic acid, 3,3′-thio-bis-(propanesulfonic acid), thiobenzamide as well as the salts thereof.
8. Treatment liquid according to any one of the preceding claims 1 – 2 , wherein at least one inorganic acid is contained.
9. Use of the acidic treatment liquid according to any one of the claims 1 to 2 for forming copper surfaces on printed circuit boards, the copper surfaces being suitable for the subsequent coating with plating resists, etch resists, solder masks and other dielectric films.
10. Method of treating copper surfaces comprising bringing into contact the copper surfaces with an acidic treatment liquid comprising
a. hydrogen peroxide and
b. at least one five-membered heterocyclic compound
wherein
c. additionally at least one microstructure modifying agent is contained, selected from the group consisting of organic thiols, organic disulfides and organic sulfides, wherein the organic sulfides have the formula
wherein
R 1 and R 2 =alkyl, alkenyl, aryl, aralkyl, cycloalkyl and the derivatives thereof.
11. Method according to claim 10 , wherein the organic thiols have the general formula
the organic disulfides have the general formula
wherein
R 1 and R 2 =alkyl, alkenyl, aryl, aralkyl, cycloalkyl and the derivatives thereof.