Polyvinylammonium compound, method of manufacturing same, acidic solution containing said compound and method of electrolytically depositing a copper deposit

1. An aqueous acidic solution for electrolytically depositing copper coatings said acidic solution containing copper ions, characterized in that said solution contains at least one polyvinylammonium compound selected from the group comprising compounds having general chemical formula (I):

wherein

l, m and n are indices of monomer units indicating the fraction, to be expressed in [mole %], of the respective monomer units in the polyvinylammonium compound, wherein l+m+n in the compound is 100 mole % with the proviso that

1) l+m is in a range of from 1 to 100 mole %, relating to l+m+n, and n is in a range of from 99 to 0 mole %, relating to l+m+n, and

2) m is in a range of from 1 to 100 mole %, relating to l+m, and l is in a range of from 99 to 0 mole %, relating to l+m,

R 1 is a radical, selected from the group comprising substituted and unsubstituted aralkyl and alkenyl,

R 2 is CHO or H, with R 2 being the same or different in all the monomer units having index l in the polyvinylammonium compound, with the proviso that the fraction of the H-containing monomer units having index l is within a range of from 1 to 100 mole %, relating to all the monomer units having index l, and that the fraction of the CHO-containing monomer units having index l is within a range of from 99 to 0 mole %, relating to all the monomer units having index l,

R 3 is a radical selected from the group comprising saturated carboxylic acids having 1 to 6 carbon atoms, unsaturated carboxylic acids having 3 to 8 carbon atoms as well as esters, anhydrides, amides and nitriles of the said carboxylic acids, with R 3 being the same or different in all the monomer units having index n in the polyvinylammonium compound, and

A − is an acid anion,

as well as

compounds having general chemical formula (I), wherein one of the monomer units having index l or m or both are present in the neutral form.

2. The aqueous acidic solution according to claim 1 , characterized in that aralkyl is benzyl or phenylethyl.

3. The aqueous acidic solution according to any one of the preceding claims 1 - 2 , characterized in that alkenyl is vinyl or allyl.

4. The aqueous acidic solution according to any one of the preceding claims 1 - 2 , characterized in that the saturated carboxylic acids are selected from the group comprising ethanoic acid, propionic acid and butyric acid.

5. The aqueous acidic solution according to any one of the preceding claims 1 - 2 , characterized in that the unsaturated carboxylic acids are selected from the group comprising acrylic acid, methacrylic acid, crotonic acid, vinylacetic acid, maleic acid, fumaric acid and itaconic acid.

6. The aqueous acidic solution according to any one of the preceding claims 1 - 2 , characterized in that the at least one polyvinylammonium compound is contained in a concentration in a range of from 0.0001 to 4 g/l.

7. The aqueous acidic solution according to any one of the preceding claims 1 - 2 , characterized in that the acidic solution additionally contains compounds selected from the group comprising nitrogen-containing sulfur compounds and polymeric nitrogen compounds.

8. The aqueous acidic solution according to claim 7 , characterized in that the acidic solution contains the nitrogen-containing sulfur compounds and the polymeric nitrogen-containing compounds in an overall concentration in a range of from 0.0001 to 0.50 g/l.

9. A method for electrolytically depositing a copper deposit, comprising bringing a workpiece and an anode into contact with a copper ions containing acidic solution and generating an electric current flow between the workpiece and the anode, characterized in that the solution contains at least one polyvinylammonium compound selected from the group comprising compounds having general chemical formula (I):

wherein

l, m and n are indices of monomer units indicating the fraction, to be expressed in [mole %], of the respective monomer units in the polyvinylammonium compound, wherein l+m+n in the compound is 100 mole % with the proviso that

1) l+m is in a range of from 1 to 100 mole %, relating to l+m+n, and n is in a range of from 99 to 0 mole %, relating to l+m+n, and

2) m is in a range of from 1 to 100 mole %, relating to l+m, and l is in a range of from 99 to 0 mole %, relating to l+m,

R 1 is a radical, selected from the group comprising substituted and unsubstituted aralkyl and alkenyl,

R 2 is CHO or H, with R 2 being the same or different in all the monomer units having index l in the polyvinylammonium compound, with the proviso that the fraction of the H-containing monomer units having index l is within a range of from 1 to 100 mole %, relating to all the monomer units having index l, and that the fraction of the CHO-containing monomer units having index l is within a range of from 99 to 0 mole %, relating to all the monomer units having index l,

R 3 is a radical selected from the group comprising saturated carboxylic acids having 1 to 6 carbon atoms, unsaturated carboxylic acids having 3 to 8 carbon atoms as well as esters, anhydrides, amides and nitriles of the said carboxylic acids, with R 3 being the same or different in all the monomer units having index n in the polyvinylammonium compound, and

A − is an acid anion,

as well as

compounds having general chemical formula (I), wherein one of the monomer units having index l or m or both are present in the neutral form.

10. The method according to claim 9 for depositing a mirror-polished, leveled copper deposit for the purpose of producing decorative surfaces.

11. The method according to claim 9 for producing a copper deposit on printed circuit boards provided with blind microvias.

12. The method according to claim 9 for producing a copper deposit on semiconductor substrates.