Method for metallizing insulating substrates wherein the roughening and etching processes are controlled by means of gloss measurement
View Patent ↗The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards.
1. A method for metallizing insulating substrates by etching said insulating substrates with etching solutions at a concentration, at a temperature and for a time sufficient to achieve roughening and/or desmear of the surface of said substrates and metallizing said substrates, comprising the following steps:
(A) determining optimized treatment parameters for a substrate according to steps (i) to (vi):
(i) etching the substrates using varying etching parameters selected from etching temperature, etching time and etchant concentration,
(ii) determining the gloss value of the surface of the etched substrates obtained in step (i) above by an optical gloss device,
(iii) metallizing the etched substrates obtained in step (i) above,
(iv) determining the peel strength of the metallized substrates obtained in (iii) above,
(v) correlating the peel strength and the gloss value obtained in (ii) and (iv) above,
(vi) using said correlation to determine the gloss value correlating with the maximum peel strength; and
(B) controlling the etching parameters during treatment of the substrate using optimized treatment parameters from (A) above—such that any deviation of the actual gloss value from the gloss value obtained in step (vi) is minimized.
2. The method according to claim 1 wherein the gloss value of the surface of said substrates is determined before etching to obtain the gloss value of the unetched surface and to calculate the relative gloss value of the surface of the etched substrates obtained in step (i) according to the following equation:
relative
gloss
value
=
current
gloss
value
gloss
value
of
unetched
surface
·
100
%
and wherein in steps (v), (vi) and (B) said relative gloss value is used.
3. The method according to claim 1 wherein the substrate is a printed circuit board with or without drill holes.
4. The method according to claim 1 wherein the gloss value of the surface is measured at an angle between 20-90°.
5. The method according to claim 4 wherein the gloss value of the surface is measured at an angle ranging from 40°-88°.
6. The method according to claim 3 wherein the gloss value of the surface is measured at an angle of about 85°.
7. The method according to claim 1 wherein the etching solution is a solution containing sodium or potassium permanganate, sodium or potassium manganate and sodium or potassium hydroxide.
8. The method according to claim 1 wherein the gloss value is determined at different areas of the substrate to ensure homogeneous etching processes.
9. The method according to claim 1 wherein the etching parameters are varied independently or in combination to achieve the desired gloss value.