Method for improving the adhesion between silver surfaces and resin materials
View Patent ↗The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode. In a particular embodiment of this method, the present invention provides a method for producing a surface mounted electronic device comprising the following steps: (i) providing a lead frame having copper and silver surfaces, (ii) electrolytically treating the silver surfaces of the lead frame with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the lead frame is the cathode, (iii) encapsulating an electronic device together with the lead frame using a resin material.
1. A method for producing a surface mounted electronic device comprising the following steps carried out in this order:
(i) providing a lead frame having copper and silver surfaces,
(ii) electrolytically treating the silver surfaces of the lead frame with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the lead frame is a cathode, and
(iii) encapsulating an electronic device together with the lead frame using a resin material;
wherein the concentration of the hydroxide in the treatment solution is from 10 to 500 g/l, and wherein the step of electrolytically treating the silver surface is carried out without depositing any metals on the silver surface.
2. The method of claim 1 , wherein the solution is essentially free of metal ions other than alkali or alkaline earth metal ions.
3. The method of claim 1 , wherein the temperature of the solution with which the silver surface is treated is from 20 to 50° C.
4. The method of claim 1 , wherein the duration of the electrolytic treatment is from 5 to 300 seconds.
5. The method of claim 1 , wherein the cathodic current density applied in the step of electrolytically treating the silver surface is from 2 to 40 A/dm 2 .
6. The method of claim 1 , wherein the hydroxide is sodium hydroxide or potassium hydroxide.
7. The method of claim 1 , wherein the treatment solution additionally contains a silicate salt.
8. The method of claim 7 , wherein the concentration of the silicate salt in the treatment solution, is from 1 to 100 g/l.
9. The method of claim 1 , wherein the treatment solution contains one or more conductivity-enhancing salts.
10. The method of claim 9 , wherein the concentration of conductivity-enhancing salts in the treatment solution is from 1 to 100 g/l.
11. The method of claim 1 , wherein the treatment solution contains one or more surfactants.
12. A method for producing a surface mounted electronic device comprising the following steps carried out in this order:
(i) providing a lead frame having copper and silver surfaces,
(ii) roughening the Cu surfaces,
(iii) electrolytically treating the silver surfaces of the lead frame with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the lead frame is a cathode, and
(iv) encapsulating an electronic device together with the lead frame using a resin material;
wherein the concentration of the hydroxide in the treatment solution is from 10 to 500 g/l, and wherein the step of electrolytically treating the silver surface is carried out without depositing any metals on the silver surface.