Process for etching a recessed structure filled with tin or a tin alloy
View Patent ↗A process for etching excess tin or tin alloy deposits including the steps of providing a substrate having recessed structures filled with tin or a tin alloy and an excess layer of tin or tin alloy, providing an aqueous etching solution consisting of a source of hydroxide ions and a nitro-substituted aromatic sulfonic acid and having a pH value greater than 7, and contacting said substrate with said aqueous etching solution for removing said excess tin or tin alloy layer on top of the recessed structures filled with tin or a tin alloy.
1. A process for manufacture of a printed circuit board or an integrated circuit, comprising
depositing tin or a tin alloy on a substrate to fill recessed structures and forming an excess layer of tin or tin alloy, and then etching away the excess layer of tin or tin alloy comprising the steps of
a. providing the substrate having the recessed structures filled with tin or a tin alloy and the excess layer of tin or tin alloy,
b. providing an aqueous etching solution consisting of a source of hydroxide ions and a nitro-substituted aromatic sulfonic acid and having a pH value greater than 7,
c. contacting said substrate with said aqueous etching solution at a temperature of 30 to 70° C. for a time ranging from 60 seconds to 120 seconds for removing said excess tin or tin alloy layer on top of said recessed structures filled with tin or a tin alloy, wherein the contacting is sufficient to remove only the excess layer of tin or tin alloy but not to form dimples in the tin or tin alloy filling the recessed structures.
2. A process according to claim 1 wherein the source of hydroxide ions is selected from the group consisting of LiOH, NaOH, KOH and NH 4 OH.
3. A process according to claim 1 wherein the concentration of hydroxide ions ranges from 20 to 30 g/l.
4. A process according to claim 1 wherein the nitro-substituted aromatic sulfonic acid is selected from the group consisting of o-nitrobenzene sulfonic acid, m-nitrobenzene sulfonic acid, p-nitrobenzene sulfonic acid and mixtures thereof.
5. A process according to claim 1 wherein the concentration of the nitro-substituted aromatic sulfonic acid ranges from 30 to 60 g/l.
6. A process according to claim 1 wherein the pH value ranges from 11 to 14.
7. A process according to claim 1 wherein the aqueous etching solution further contains a wetting agent.
8. A process according to claim 1 wherein the substrate is contacted with the aqueous etching solution by horizontal processing with spray or flood application.